MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
8-Bit Addressable Latch
1-of-8 Decoder
High±Performance Silicon±Gate CMOS
The MC54/74HC259A is identical in pinout to the LS259. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
The HC259A has four modes of operation as shown in the mode selection table. In the addressable latch mode, the data on Data In is written into the addressed latch. The addressed latch follows the data input with all non±addressed latches remaining in their previous states. In the memory mode, all latches remain in their previous state and are unaffected by the Data or Address inputs. In the one±of±eight decoding or demultiplexing mode, the addressed output follows the state of Data In with all other outputs in the LOW state. In the Reset mode all outputs are LOW and unaffected by the address and data inputs. When operating the HC259A as an addressable latch, changing more than one bit of the address could impose a transient wrong address. Therefore, this should only be done while in the memory mode.
•Output Drive Capability: 10 LSTTL Loads
•Outputs Directly Interface to CMOS, NMOS, and TTL
•Operating Voltage Range: 2 to 6 V
•Low Input Current: 1 μA
•High Noise Immunity Characteristic of CMOS Devices
•In Compliance with the Requirements Defined by JEDEC Standard No. 7A
•Chip Complexity: 202 FETs or 50.5 Equivalent Gates
LOGIC DIAGRAM
ADDRESS |
A0 |
1 |
4 |
Q0 |
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A1 |
2 |
5 |
Q1 |
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INPUTS |
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A2 |
3 |
6 |
Q2 |
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7 |
Q3 |
NONINVERTING |
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9 |
Q4 |
OUTPUTS |
DATA IN |
13 |
10 Q5 |
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11 |
Q6 |
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12 |
Q7 |
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RESET |
15 |
PIN 16 = V |
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14 |
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CC |
ENABLE |
PIN 8 = GND |
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MC54/74HC259A
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J SUFFIX |
16 |
CERAMIC PACKAGE |
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CASE 620±10 |
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1 |
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N SUFFIX |
16 |
PLASTIC PACKAGE |
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CASE 648±08 |
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1 |
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D SUFFIX |
16 |
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SOIC PACKAGE |
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1 |
CASE 751B±05 |
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DT SUFFIX |
16 |
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TSSOP PACKAGE |
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1 |
CASE 948F±01 |
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ORDERING INFORMATION |
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MC54HCXXXAJ |
Ceramic |
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MC74HCXXXAN |
Plastic |
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MC74HCXXXAD |
SOIC |
MC74HCXXXADT TSSOP
PIN ASSIGNMENT
A0 |
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1 |
16 |
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VCC |
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A1 |
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2 |
15 |
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RESET |
A2 |
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3 |
14 |
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ENABLE |
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Q0 |
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4 |
13 |
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DATA IN |
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Q1 |
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5 |
12 |
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Q7 |
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Q2 |
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6 |
11 |
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Q6 |
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Q3 |
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7 |
10 |
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Q5 |
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GND |
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8 |
9 |
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Q4 |
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MODE SELECTION TABLE
Enable |
Reset |
Mode |
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L |
H |
Addressable Latch |
H |
H |
Memory |
L |
L |
8±Line Demultiplexer |
H |
L |
Reset |
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LATCH SELECTION TABLE
Address Inputs |
Latch |
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C |
B |
A |
Addressed |
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L |
L |
L |
Q0 |
L |
L |
H |
Q1 |
L |
H |
L |
Q2 |
L |
H |
H |
Q3 |
H |
L |
L |
Q4 |
H |
L |
H |
Q5 |
H |
H |
L |
Q6 |
H |
H |
H |
Q7 |
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This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
10/95
Motorola, Inc. 1995 |
REV 0 |
MC54/74HC259A
MAXIMUM RATINGS*
Symbol |
Parameter |
Value |
Unit |
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VCC |
DC Supply Voltage (Referenced to GND) |
± 0.5 to + 7.0 |
V |
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Vin |
DC Input Voltage (Referenced to GND) |
± 0.5 to VCC + 0.5 |
V |
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Vout |
DC Output Voltage (Referenced to GND) |
± 0.5 to VCC + 0.5 |
V |
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Iin |
DC Input Current, per Pin |
± 20 |
mA |
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Iout |
DC Output Current, per Pin |
± 25 |
mA |
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ICC |
DC Supply Current, VCC and GND Pins |
± 50 |
mA |
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PD |
Power Dissipation in Still Air, Plastic or Ceramic DIP² |
750 |
mW |
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SOIC Package² |
500 |
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TSSOP Package² |
450 |
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Tstg |
Storage Temperature |
± 65 to + 150 |
_C |
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TL |
Lead Temperature, 1 mm from Case for 10 Seconds |
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_C |
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Plastic DIP, SOIC or TSSOP Package |
260 |
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(Ceramic DIP) |
300 |
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This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC. Unused inputs must always be
tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C Ceramic DIP: ± 10 mW/_C from 100_ to 125_C
SOIC Package: ± 7 mW/_C from 65_ to 125_C
TSSOP Package: ± 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol |
Parameter |
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Min |
Max |
Unit |
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VCC |
DC Supply Voltage (Referenced to GND) |
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2.0 |
6.0 |
V |
Vin, Vout |
DC Input Voltage, Output Voltage (Referenced to GND) |
0 |
VCC |
V |
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TA |
Operating Temperature, All Package Types |
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± 55 |
+ 125 |
_C |
tr, tf |
Input Rise and Fall Time |
VCC = 2.0 V |
0 |
1000 |
ns |
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(Figure 1) |
VCC = 3.0 V |
0 |
600 |
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VCC = 4.5 V |
0 |
500 |
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VCC = 6.0 V |
0 |
400 |
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
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Guaranteed Limit |
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VCC |
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± 55 to |
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Symbol |
Parameter |
Test Conditions |
V |
25_C |
v 85_C |
v 125_C |
Unit |
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VIH |
Minimum High±Level Input |
Vout = 0.1 V or VCC ± 0.1 V |
2.0 |
1.5 |
1.5 |
1.5 |
V |
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Voltage |
|Iout| v 20 μA |
3.0 |
2.1 |
2.1 |
2.1 |
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4.5 |
3.15 |
3.15 |
3.15 |
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6.0 |
4.2 |
4.2 |
4.2 |
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VIL |
Maximum Low±Level Input |
Vout = 0.1 V or VCC ± 0.1 V |
2.0 |
0.5 |
0.5 |
0.5 |
V |
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Voltage |
|Iout| v 20 μA |
3.0 |
0.9 |
0.9 |
0.9 |
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4.5 |
1.35 |
1.35 |
1.35 |
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6.0 |
1.80 |
1.80 |
1.80 |
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VOH |
Minimum High±Level Output |
Vin = VIH or VIL |
2.0 |
1.9 |
1.9 |
1.9 |
V |
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Voltage |
|Iout| v 20 μA |
4.5 |
4.4 |
4.4 |
4.4 |
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6.0 |
5.9 |
5.9 |
5.9 |
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Vin = VIH or VIL |Iout| v 2.4 mA |
3.0 |
2.48 |
2.34 |
2.20 |
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|Iout| v 4.0 mA |
4.5 |
3.98 |
3.84 |
3.70 |
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|Iout| v 5.2 mA |
6.0 |
5.48 |
5.34 |
5.20 |
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MOTOROLA |
2 |
MC54/74HC259A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
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Guaranteed Limit |
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VCC |
± 55 to |
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Symbol |
Parameter |
Test Conditions |
V |
25_C |
v 85_C |
v 125_C |
Unit |
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VOL |
Maximum Low±Level Output |
Vin = VIH or VIL |
2.0 |
0.1 |
0.1 |
0.1 |
V |
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Voltage |
|Iout| v 20 μA |
4.5 |
0.1 |
0.1 |
0.1 |
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6.0 |
0.1 |
0.1 |
0.1 |
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Vin = VIH or VIL |Iout| v 2.4 mA |
3.0 |
0.26 |
0.33 |
0.40 |
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|Iout| v 4.0 mA |
4.5 |
0.26 |
0.33 |
0.40 |
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|Iout| v 5.2 mA |
6.0 |
0.26 |
0.33 |
0.40 |
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Iin |
Maximum Input Leakage Current |
Vin = VCC or GND |
6.0 |
± 0.1 |
± 1.0 |
± 1.0 |
μA |
ICC |
Maximum Quiescent Supply |
Vin = VCC or GND |
6.0 |
4 |
40 |
160 |
μA |
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Current (per Package) |
Iout = 0 μA |
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NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
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Guaranteed Limit |
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VCC |
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± 55 to |
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Symbol |
Parameter |
V |
25_C |
v 85_C |
v 125_C |
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Unit |
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tPLH, |
Maximum Propagation Delay, Data to Output |
2.0 |
125 |
160 |
175 |
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ns |
tPHL |
(Figures 1 and 6) |
3.0 |
45 |
60 |
70 |
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4.5 |
32 |
32 |
42 |
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6.0 |
25 |
28 |
33 |
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tPLH, |
Maximum Propagation Delay, Address Select to Output |
2.0 |
150 |
175 |
200 |
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ns |
tPHL |
(Figures 2 and 6) |
3.0 |
60 |
70 |
80 |
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4.5 |
32 |
40 |
45 |
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6.0 |
28 |
30 |
35 |
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tPLH, |
Maximum Propagation Delay, Enable to Output |
2.0 |
150 |
175 |
200 |
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ns |
tPHL |
(Figures 3 and 6) |
3.0 |
60 |
70 |
80 |
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4.5 |
32 |
40 |
45 |
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6.0 |
28 |
30 |
35 |
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tPHL |
Maximum Propagation Delay, Reset to Output |
2.0 |
110 |
125 |
160 |
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ns |
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(Figures 4 and 6) |
3.0 |
36 |
45 |
60 |
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4.5 |
22 |
26 |
32 |
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6.0 |
19 |
23 |
28 |
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tTLH, |
Maximum Output Transition Time, Any Output |
2.0 |
75 |
95 |
110 |
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ns |
tTHL |
(Figures 1 and 6) |
3.0 |
27 |
32 |
36 |
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4.5 |
15 |
19 |
22 |
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6.0 |
13 |
16 |
19 |
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Cin |
Maximum Input Capacitance |
Ð |
10 |
10 |
10 |
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pF |
NOTES: |
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1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D). |
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2. Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D). |
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Typical @ 25°C, VCC = 5.0 V |
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CPD |
Power Dissipation Capacitance (Per Package)* |
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30 |
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pF |
* Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).
3 |
MOTOROLA |
MC54/74HC259A
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
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Guaranteed Limit |
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VCC |
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± 55 to |
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Symbol |
Parameter |
V |
25_C |
v 85_C |
v 125_C |
Unit |
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tsu |
Minimum Setup Time, Address or Data to Enable |
2.0 |
75 |
95 |
110 |
ns |
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(Figure 5) |
3.0 |
30 |
40 |
55 |
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4.5 |
15 |
19 |
22 |
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6.0 |
13 |
16 |
19 |
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th |
Minimum Hold Time, Enable to Address or Data |
2.0 |
1 |
1 |
1 |
ns |
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(Figure 5) |
3.0 |
1 |
1 |
1 |
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4.5 |
1 |
1 |
1 |
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6.0 |
1 |
1 |
1 |
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tw |
Minimum Pulse Width, Reset or Enable |
2.0 |
70 |
90 |
100 |
ns |
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(Figure 3 or 4) |
3.0 |
27 |
32 |
36 |
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4.5 |
15 |
19 |
22 |
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6.0 |
13 |
16 |
19 |
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tr, tf |
Maximum Input Rise and Fall Times |
2.0 |
1000 |
1000 |
1000 |
ns |
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(Figure 1) |
3.0 |
800 |
800 |
800 |
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4.5 |
500 |
500 |
500 |
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6.0 |
400 |
400 |
400 |
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NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).
MOTOROLA |
4 |
MC54/74HC259A
SWITCHING WAVEFORMS
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DATA IN |
VCC |
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GND |
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VCC |
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50% |
tr |
tf |
VCC |
ADDRESS |
GND |
DATA IN |
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90% |
SELECT |
VCC |
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50% |
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10% |
GND |
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50% |
tPLH |
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tPHL |
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GND |
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90% |
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tPHL |
tPLH |
OUTPUT Q |
50% |
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10% |
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OUTPUT Q |
50% |
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tTLH |
tTHL |
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Figure 1. |
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Figure 2. |
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VCC |
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VCC |
DATA IN |
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DATA IN |
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GND |
GND |
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tw |
tw |
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tw |
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VCC |
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V |
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ENABLE |
50% |
50% |
50% |
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CC |
GND |
RESET |
50% |
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tPHL |
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tPLH |
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GND |
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tPHL |
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OUTPUT Q |
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OUTPUT Q |
50% |
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Figure 3. |
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Figure 4. |
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TEST POINT |
DATA IN |
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VCC |
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OUTPUT |
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DEVICE |
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OR |
50% |
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ADDRESS |
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GND |
UNDER |
CL* |
SELECT |
th(H) |
tsu |
th(L) |
TEST |
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tsu |
VCC |
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ENABLE |
50% |
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GND |
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* Includes all probe and jig capacitance |
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Figure 5. |
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Figure 6. Test Circuit |
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5 |
MOTOROLA |