Материал: HGTP20N6

Handling Precautions for IGBTs

Insulated Gate Bipolar Transistors are susceptible to gateinsulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBT’s are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken:

1.Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting

springs or by the insertion into conductive material such as “ECCOSORBD™ LD26” or equivalent.

2.When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband.

3.Tips of soldering irons should be grounded.

4.Devices should never be inserted into or removed from circuits with power on.

5.Gate Voltage Rating - Never exceed the gate-voltage rat-

ing of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region.

6.Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate open-cir- cuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup.

7.Gate Protection - These devices do not have an internal monolithic zener diode from gate to emitter. If gate protection is required an external zener is recommended.

TO-220AB

3 LEAD JEDEC TO-220AB PLASTIC PACKAGE

NOTES:

1.These dimensions are within allowable dimensions of Rev. J of JEDEC TO-220AB outline dated 3-24-87.

2.Lead dimension and finish uncontrolled in L1.

3.Lead dimension (without solder).

4.Add typically 0.002 inches (0.05mm) for solder coating.

5.Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D.

6.Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D.

7.Controlling dimension: Inch.

8.Revision 1 dated 1-93.

Packaging (Continued)

ØR

D

TO-247

3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE

NOTES:

1.Lead dimension and finish uncontrolled in L1.

2.Lead dimension (without solder).

3.Add typically 0.002 inches (0.05mm) for solder coating.

4.Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D.

5.Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D.

6.Controlling dimension: Inch.

7.Revision 1 dated 1-93.