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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MRF166W/D

The RF MOSFET Line

Power Field Effect Transistor

N±Channel Enhancement±Mode MOSFET

Designed primarily for wideband large±signal output and driver stages to 500 MHz.

•Push±Pull Configuration Reduces Even Numbered Harmonics

•Typical Performance at 400 MHz, 28 Vdc

Output Power = 40 Watts

Gain = 13 dB

Efficiency = 50%

•Typical Performance at 175 MHz, 28 Vdc Output Power = 40 Watts

Gain = 17 dB Efficiency = 60%

•Excellent Thermal Stability, Ideally Suited for Class A Operation

•Facilitates Manual Gain Control, ALC and Modulation Techniques

•100% Tested for Load Mismatch at All Phase Angles with 30:1 VSWR

•Low Crss Ð 4.5 pF @ V DS = 28 Volts

•Circuit board photomaster available upon request by contacting RF Tactical Marketing in Phoenix, AZ.

MRF166W

40 W, 500 MHz

TMOS BROADBAND RF POWER FET

CASE 412±01, Style 1

3

4

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

1

5

FLANGE

2

Rating

Symbol

Value

Unit

 

 

 

 

Drain±Gate Voltage

VDSS

65

Vdc

Drain±Gate Voltage (RGS = 1.0 MΩ)

VDGR

65

Vdc

Gate±Source Voltage

VGS

± 40

Adc

Drain Current Ð Continuous

ID

8.0

ADC

Total Device Dissipation @ TC = 25°C

PD

175

Watts

Derate above 25°C

 

1.0

°C/W

 

 

 

 

Storage Temperature Range

Tstg

± 65 to +150

°C

Operating Junction Temperature

TJ

200

°C

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

Thermal Resistance Ð Junction to Case

RθJC

1.0

°C/W

NOTE: Handling and Packaging Ð MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.

REV 1

Motorola, Inc. 1994

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

OFF CHARACTERISTICS (1)

Drain±Source Breakdown Voltage

V(BR)DSS

 

 

 

 

Vdc

 

(VGS = 0 Vdc, ID = 5.0 mA)

 

65

 

Ð

Ð

 

Zero Gate Voltage Drain Current

IDSS

 

 

 

 

mA

 

(VDS = 28 Vdc, VGS = 0 Vdc)

 

Ð

 

Ð

1.0

 

Gate±Source Leakage Current

IGSS

 

 

 

 

μA

 

(VGS = 40 Vdc, VDS = 0 Vdc)

 

Ð

 

Ð

1.0

 

ON CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

Gate Threshold Voltage

VGS(th)

 

 

 

 

Vdc

 

(VDS= 10 Vdc, ID = 25 mA)

 

1.0

 

3.0

6.0

 

Forward Transconductance

gfs

 

 

 

 

mS

 

(VDS= 10 Vdc, ID = 1.5 A)

 

600

 

800

Ð

 

DYNAMIC CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

Ciss

Ð

 

30

Ð

pF

 

(VDS = 28 Vdc, VGS = 0 Vdc, f = 1.0 MHz)

 

 

 

Output Capacitance

Coss

 

 

 

 

pF

 

(VDS = 28 Vdc, VGS = 0 Vdc, f = 1.0 MHz)

 

Ð

 

35

Ð

 

Reverse Transfer Capacitance

Crss

 

 

 

 

pF

 

(VDS = 28 Vdc, VGS = 0 Vdc, f = 1.0 MHz)

 

Ð

 

4.5

Ð

 

FUNCTIONAL CHARACTERISTICS (2)

 

 

 

 

 

 

 

 

 

 

 

 

Common Source Power Gain

Gps

 

 

 

 

dB

 

(VDD = 28 Vdc, Pout = 40 W, f = 400 MHz, IDG = 100 mA)

 

11

 

13

Ð

 

Drain Efficiency

η

 

 

 

 

%

 

(VDD = 28 Vdc, Pout = 40 W, f = 400 MHz, IDG = 100 mA)

 

45

 

50

Ð

 

Electrical Ruggedness

Ψ

 

 

 

 

 

 

(VDD = 28 Vdc, Pout = 40 W, f = 400 MHz, IDG = 100 mA)

 

 

No Degradation in Output Power

 

Load VSWR = 30:1, All phase angles at frequency of test

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(1)

Each transistor chip measured separately.

 

 

 

 

 

 

(2)

Both transistor chips operating in a push±pull amplifier.

 

 

 

 

 

 

MRF166W

MOTOROLA RF DEVICE DATA

2

 

 

 

 

 

 

 

B

 

 

 

 

 

 

 

 

R7

 

RFC1

 

 

 

VDD 28 V

 

 

 

 

 

 

 

 

 

 

A

R1

C14

D1

 

 

 

C17

+

 

+

C22

C15

C16

C18

Vdc

R2

 

 

±

 

 

 

 

 

 

RFC2

 

 

±

 

 

 

 

 

 

 

 

 

 

 

A

 

 

 

 

C10

 

 

 

T1

 

C21

 

C13

 

 

 

Z8

C8

 

 

 

 

 

 

 

 

 

L1

 

R4

 

R3

 

 

T2

C2

Z2

Z3

 

 

Z7

 

 

 

RF INPUT

C23

 

L3

Z5

D.U.T.

 

 

 

 

 

 

C6

C7

C3

 

 

 

C5

 

 

 

 

C4

 

 

 

 

 

RF OUTPUT

 

 

 

 

Z6

 

 

 

 

 

 

 

 

 

 

 

 

 

C1

Z1

L2

Z4

L4

 

Z9

 

Z10

C9

 

 

 

 

R5

 

R6

 

 

 

 

A

 

 

 

 

C11

 

 

 

 

 

 

 

 

 

RFC3

 

B

 

 

C20

 

C12

 

 

C19

 

 

 

 

 

 

 

 

L3, L4

0.065″

L1, L2

0.116″

 

 

 

 

 

 

 

 

 

 

 

 

 

0.265″

0.455″

 

C1, C2, C8, C9,

270 pF, Chip Cap

RFC1

Ferroxcube VK±200±19/4B

C12, C13, C15

 

RFC2, RFC3

10T, ID = 1/4″ , 18 AWG

C3

5.6 pF, Chip Cap

R1

10 kW, 10T

C4

20 pF, Chip Cap

R2

9.2 kW, 1/2 W

C5

0 ± 20 pF, Johanson*

R3, R6

330 W, 1.0 W

C6

8.2 pF, Chip Cap

R4 R5

520 W, 1/4 W

C7

15 pF, Chip Cap

R7

1.5 kW, 1/2 W

C10, C11, C14, C19,

0.01 mF

T1, T2

Balun 2.0″ , 50 W Semi±Rigid Coax

C20, C21, C22

 

Z1, Z2

0.120 x 0.467″

C16, C17

680 pF, Feedthru

Z3, Z4

0.120 x 0.55″ *

C18

10 mF, 50 V

Z5, Z6

0.120 x 0.49″

C23

0 ± 10 pF, Johanson*

Z7, Z9

0.120 x 0.85″

D1

IN5343 ± Motorola Zener

Z8, Z10

0.120 x 0.6″ for C6

L1, L2

Hair Pin Inductor #18 AWG,

 

 

 

0.065 W x 0.265 H

* C4, C5 Center of Z3 and Z4

L3, L4

Hair Pin Inductor #18 AWG,

Board Material ± Teflon

Fiberglass

 

0.116 W x 0.445 H

Dielectric Thickness = 0.030″ , er = 2.55 Copper Clad, 2.0 oz. Copper

Figure 1. MRF166 400 MHz Test Circuit Schematic

MOTOROLA RF DEVICE DATA

MRF166W

 

3

Pout , OUTPUT POWER (WATTS)

50

f = 175 MHz

 

 

 

45

 

 

 

 

 

 

400 MHz

40

 

 

 

 

 

 

 

35

 

 

 

500 MHz

30

 

 

 

 

25

 

 

 

 

20

 

 

 

 

15

 

 

 

 

10

 

 

 

 

5

 

 

 

VDD = 28 Vdc

 

 

 

IDQ = 200 mA

0

 

 

 

0

1

2

3

4

Pin, INPUT POWER (WATTS)

Pout , OUTPUT POWER (WATTS)

45

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

f = 400

MHz

 

 

 

 

 

 

 

 

Pin =

3.0 W

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IDQ =

100 mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

35

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0 W

 

30

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0 W

 

25

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.5 W

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

14

16

18

20

22

24

26

28

12

VDS, DRAIN±SOURCE VOLTAGE (VOLTS)

Figure 2. Output Power versus Input Power

Figure 3. Output Power versus Voltage

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

100

 

 

 

V

DD = 28 Vdc

 

 

 

 

 

 

 

 

 

 

 

 

35

 

 

 

 

 

 

 

 

 

 

 

90

 

(WATTS)

 

IDQ = 100 mA

 

SHOWN,

 

 

 

 

 

 

 

(pF)

70

 

 

 

TYPICAL DEVICE

 

 

 

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

 

 

 

 

 

80

 

OUTPUT, POWER

 

 

 

 

 

 

 

 

 

 

 

 

CAPACITANCEC,

 

 

25

 

VGS(th) = 3.0 V

 

 

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

 

 

 

 

60

 

 

20

 

 

 

 

 

 

 

f =

400

MHz

 

 

 

50

 

 

15

 

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

out

10

 

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P

5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

±10

± 9 ± 8 ±7 ± 6 ± 5 ± 4 ± 3 ± 2 ±1 0 1 2

3

0

VGS, GATE±SOURCE VOLTAGE (VOLTS)

Figure 4. Output Power versus Gate Voltage

VGS = 0 V

f = 1.0 MHz

Coss

Ciss

Crss

4

8

12

16

20

24

28

 

VDS, DRAIN±SOURCE VOLTAGE (VOLTS)

 

 

Figure 5. Capacitance versus Voltage

MRF166W

MOTOROLA RF DEVICE DATA

4

 

f = 500 MHz

Zin

400

ZOL*

f = 500 MHz

400 175

175

Zo = 50 Ω

VDD = 28 Vdc, IDQ = 100 mA, Pout = 40 W

f

 

Zin

 

ZOL*

MHz

 

Ohms

 

Ohms

 

 

 

 

 

175

3.7 ±

j 22.4

15.2

± j 16.6

 

 

 

 

 

400

3.6 ±

j 10.99

10.3

± j 7.99

 

 

 

 

 

500

2.6 ±

j 3.2

10.2

+ j 0.5

 

 

 

 

 

Table 1. Input and Output Impedances

ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, voltage and frequency.

NOTE: Input and output impedance values given are measured from gate to gate and drain to drain respectively.

Figure 6. Series Equivalent Input/Output Impedance

MOTOROLA RF DEVICE DATA

MRF166W

 

5

Источник: https://studfile.net/preview/16503561/