Документ: Packages_Diodes_Inc, страницы 11-15 | База учебных материалов

Package Outline Dimensions

X2-DFN0606-3

A	A1

Seating Plane

D

D3

D2

e/2

e		E2
e		E
︶	︶
b2x	k	L2
	L2x

X2-DFN0606-3

Dim	Min		Max	Typ
A	0.36		0.42	0.39
A1	0		0.05	0.02
b	0.10		0.20	0.15
D	0.57		0.67	0.62
D2			0.155 BSC
D3		0.185 BSC
E	0.57		0.67	0.62
E2	0.40		0.60	0.50
e			0.35 BSC
k		0.16 REF
L	0.09		0.21	0.15
L2	0.11		0.31	0.21

All Dimensions in mm

Suggested Pad Layout

X2-DFN0606-3

Dimensions	Value (in mm)
C	0.350
X	0.280
X1	0.350
X2	0.760
Y	0.200
Y1	0.600

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	11 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN0806-3

A1

A3

A

Seating Plane

		D
		e
		L (2x)
E	K	b (2x)
E
	E1	Pin#1
		Pin#1
		R0.075
		D1

X2-DFN0806-3

Dim	Min	Max	Typ
A	0.375	0.40	0.39
A1	0	0.05	0.02
A3	-	-	0.10
b	0.10	0.20	0.15
D	0.55	0.65	0.60
D1	0.35	0.45	0.40
E	0.75	0.85	0.80
E1	0.20	0.30	0.25
e	-	-	0.35
K	-	-	0.20
L	0.20	0.30	0.25

All Dimensions in mm

Suggested Pad Layout

X2-DFN0806-3

X1

Dimensions

Value

Y1

(in mm)

C

0.350

Y2

X

0.200

X

X1

0.450

X2

0.550

Y

0.375

Y

Y1

0.475

Y2

1.000

C

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	12 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN0808-4

A3 AA1

Seating Plane

D

Pin#1ID e

R05.TYP

	K
	E2	D2
EL4x		D2
EL4x
︶		L14x
︶		︶
Z4x	b4x
︶	︶

X2-DFN0808-4

Dim	Min	Max	Typ
A	0.25	0.35	0.30
A1	0	0.04	0.02
A3	-	-	0.13
b	0.17	0.27	0.22
D	0.75	0.85	0.80
D2	0.15	0.35	0.25
E	0.75	0.85	0.80
E2	0.15	0.35	0.25
e	-	-	0.48
K	0.20	-	-
L	0.17	0.27	0.22
L1	0.02	0.12	0.07
Z	-	-	0.05

All Dimensions in mm

Suggested Pad Layout

		X2-DFN0808-4
	X2
	C
			Dimensions	Value
			Dimensions	(in mm)
			C	0.480
			X	0.320
	Y	Y2	X1	0.300
	Y	Y2	X2	0.800
	1		X2	0.800
	1		Y	0.320
︶			Y1	0.300
Y4x	1		Y2	0.900
	1
	X
	︶
	X4x

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	13 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		X2-DFN0910-6
A1
A		Seating Plane
		Seating Plane
D
e	Z	Z1
	Z
E K1	K
L	L1
		(Pin #1 ID)
b		C0.5X45°

X2-DFN0910-6

Dim	Min	Max	Typ
A	-	0.35	0.30
A1	0	0.03	0.02
b	0.10	0.20	0.15
D	0.85	0.95	0.90
E	0.95	1.05	1.00
e	-	-	0.30
K	0.20	-	-
K1	0.25	-	-
L	0.25	0.35	0.30
L1	0.30	0.40	0.35
Z	-	-	0.075
Z1	-	-	0.075

All Dimensions in mm

Suggested Pad Layout

X2-DFN0910-6

X1

Dimensions

Value

Y1

(in mm)

G1

G

0.100

G1

0.050

Y2

G

G2

0.150

X

0.150

X1

0.750

Y

0.525

Y1

0.475

Y2

1.150

Pin1

X

G2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	14 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		U-DFN1006-2/SWP
A	A1	c
	A1	h
	Seating Plane	h
	Seating Plane
D
Pin#1ID
E	︶
	b2x
	︶
k	L2x

U-DFN1006-2/SWP

Dim Min Max Typ

A 0.47 0.53 0.50

A1	0.0	0.05		0.03
b	0.45	0.55		0.50
c		0.55 REF
D	0.95		1.05	1.00
E	0.55		0.65	0.60
h			0.17 REF
k		0.37 REF
L	0.25		0.35	0.30

All Dimensions in mm

Suggested Pad Layout

U- DFN1006-2/SWP

X1

︶

X2x

Dimensions

Value (in mm)

X

0.45

Y

X1

1.20

Y

0.60

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	15 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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