Документ: Packages_Diodes_Inc, страницы 256-260 | База учебных материалов

Package Outline Dimensions

	D	A
E2	D2	A3
E

L

b

e c e1 A2

TO251

Option2			TO251
		Dim	Min	Max
		Dim	Min	Max
	45°	A	2.200	2.400
	45°
		A2	0.890	1.150
		A2	0.890	1.150
		A3	0.450	0.550
		A3	0.450	0.550
		b	0.550	0.740
		b	0.550	0.740
		c	0.450	0.570
Option3		D	6.400	6.750
Option3		D2	5.200	5.400
		D2	5.200	5.400
		E	5.950	6.250
		E	5.950	6.250

		E2	0.900	1.250
		E2	0.900	1.250
		e	2.240	2.340
		e1	4.430	4.730
		e1	4.430	4.730
		L	8.900	9.500
		L	8.900	9.500
		All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	256 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

TO262

	E					L1	A		c2
											TO262
											TO262
										Dim	Min	Max	Typ
						D				A	4.06	4.83	4.57
										A2	2.03	2.79	2.67
										b	0.64	0.99	-
										b	0.64	0.99	-
			L2					A2		b2	1.14	1.40	1.24
			L2					A2		b2	1.14	1.40	1.24
b2										c	0.356	0.74	-
b2										c	0.356	0.74	-

					L					c2	1.14	1.40	1.27
										D	8.64	9.65	8.70
										D	8.64	9.65	8.70
										E	9.65	10.29	10.11
								c		e		2.54 Typ
				b				c		e		2.54 Typ
		e								L	12.70	14.73	13.60
										L1	-	1.67	-
										L1	-	1.67	-
										L2	-	4.00	-
										All	Dimensions in mm

Suggested Pad Layout

TO262

Z

C

Dimensions

Value (in mm)

Z

16.9

X1

1.1

E1

X2

10.8

X2

Y1

3.5

Y2

11.4

X1

C

9.5

Y1

E1

2.5

Y2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	257 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

TO3P

									A		TO-3P
											TO-3P
										Dim	Min	Max
		H							B	A	1.88	2.08

										B	4.68	5.36
										B	4.68	5.36
					J					C	20.63	22.38
S										D	18.5	21.5
S									C	D	18.5	21.5
										E	2.10	2.40
										E	2.10	2.40
R						K				G	0.51	0.76
R						K				H	15.38	16.25
										J	1.90	2.70


P			Q	L						K	2.90	3.65
										L	3.78	4.50


							G			M	5.20	5.70
									D

N										N	0.89	1.53
N										N	0.89	1.53
										P	1.82	2.46
										Q	2.92	3.23
										Q	2.92	3.23
								E		R	11.70	12.84
										R	11.70	12.84
										S	-	6.10
	M		M							S	-	6.10
	M		M							All	Dimensions	in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	258 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

TO92

D

EJECTIO NMARK

E

b1

L

e e

BULK

D1

A2

A

					EJECTIO NMARK
					EJECTIO NMARK

	E
	E



							L2	L3
										TO92

									Dim	Min	Max	Typ
									A	3.45	3.66	-
									A2	1.22	1.37	-
									A2	1.22	1.37	-
	L1								b	-	-	0.38
	L1								c	-	-	0.38
									c	-	-	0.38
									D	4.27	4.78	-

									D1	-	-	3.87
									D1	-	-	3.87
						b			E	4.32	4.83	-
						b			e	-	-	1.27
									e	-	-	1.27
									e2	2.40	2.90	-
									e2	2.40	2.90	-
c		e2		e2					L	12.98	15.00	-
									L	12.98	15.00	-
									L1	12.80	15.00	-


			AMO						L2	0.80	-	-
			AMO						L3	2.00	3.00	-
									L3	2.00	3.00	-
									All	Dimensions in mm

h ø

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	259 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

D

EJECTIO NMARK

E

b1

L

e e

BULK

D1

A2

TO92 (Type B)

A

EJECTIO NMARK

E


									TO92 Type B
						L2	L3	Dim	Min	Max	Typ
								A	3.30	3.70	-
								A2	1.00	1.40	-
								A2	1.00	1.40	-
								b	0.38	0.55	-
								b1	0.36	0.76	-
								c	0.32	0.51	-
	L1							c	0.32	0.51	-
	L1							D	4.40	4.80	-
								D	4.40	4.80	-
								D1	3.430	-	-
								E	4.30	4.70	-
								E	4.30	4.70	-
								e	-	-	1.27
					b			e2	-	-	2.54
								e2	-	-	2.54
								h	0.00	0.38	-
c		e2		e2				L	12.50	15.50	-
c		e2		e2				L1	12.50	14.50	-

			AMO					L3	2.50	4.00	-
			AMO					ø	-	1.60	-
								ø	-	1.60	-
								All	Dimensions in mm

h ø

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	260 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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