Документ: Packages_Diodes_Inc, страницы 16-20 | База учебных материалов

Package Outline Dimensions

						X1-DFN1006-2



A
A



		A1
								X1-DFN1006-2
								X1-DFN1006-2
							Dim		Min	Max	Typ
				D			Dim		Min	Max	Typ
				D			A		0.47	0.53	0.50
							A		0.47	0.53	0.50
							A1		0	0.05	0.03
							b		0.45	0.55	0.50
							b		0.45	0.55	0.50
							D		0.95	1.075	1.00
				R			E		0.55	0.675	0.60
	E				b
	E				b		e		-	-	0.40

							L		0.20	0.30	0.25
							R		0.05	0.15	0.10
							R		0.05	0.15	0.10
							All		Dimensions in mm

			L	e
			L	e

Suggested Pad Layout

X1-DFN1006-2

X

X1

Dimensions

Value

(in mm)

C

0.70

Y

G

0.30

X

0.40

X1

1.10

G

Y

0.70

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	16 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

					X2-DFN1006-2



A							X2-DFN1006-2
							X2-DFN1006-2

							Dim	Min	Max	Typ
							Dim	Min	Max	Typ
		A1					A	0.34	0.4	0.37
							A1	0	0.05	0.03
				D			b	0.45	0.55	0.50
				D			b	0.45	0.55	0.50
							D	0.95	1.075	1.00
							D	0.95	1.075	1.00
							E	0.55	0.675	0.60
							e	-	-	0.40
				R			L	0.20	0.30	0.25


	E					b	R	0.05	0.15	0.10
							All	Dimensions in mm
							All	Dimensions in mm




			L	e
			L	e

Suggested Pad Layout

X2-DFN1006-2

X

X1

Dimensions

Value

(in mm)

C

0.70

Y

G

0.30

X

0.40

X1

1.10

G

Y

0.70

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	17 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X1-DFN1006-3

A A1

	Seating Plane
D	︶
Pin#1ID	b12X
Pin#1ID

Eb2 e

Z

L2 L3 L1

X1-DFN1006-3

Dim	Min	Max	Typ
A	0.47	0.53	0.50
A1	0	0.05	0.03
b1	0.10	0.20	0.15
b2	0.45	0.55	0.50

D0.95 1.075 1.00

E0.55 0.675 0.60

e	-	-	0.35
L1	0.20	0.30	0.25
L2	0.20	0.30	0.25
L3	-	-	0.40
Z	0.02	0.08	0.05

All Dimensions in mm

Suggested Pad Layout

X1-DFN1006-3

C

Dimensions

Value

X1

(in mm)

Z

1.1

G2

G1

0.3

X

G2

0.2

X

0.7

X1

0.25

G1

Y

0.4

Y

C

0.7

Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	18 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN1006-3

A A1

	Seating Plane
D	︶
Pin#1ID	b12X
Pin#1ID

Eb2 e

Z

L2 L3 L1

X2-DFN1006-3

Dim	Min	Max	Typ
A		0.40
A1	0	0.05	0.03
b1	0.10	0.20	0.15
b2	0.45	0.55	0.50
D	0.95	1.05	1.00
E	0.55	0.65	0.60
e	-	-	0.35
L1	0.20	0.30	0.25
L2	0.20	0.30	0.25
L3	-	-	0.40

All Dimensions in mm

Suggested Pad Layout

X2-DFN1006-3

C

Dimensions

Value

X1

(in mm)

Z

1.1

G2

G1

0.3

X

G2

0.2

X

0.7

X1

0.25

G1

Y

0.4

Y

C

0.7

Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	19 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN1010-3

A1	A3
A1
A
	Seating Plane

D
(Pin #1 ID)
E2
E
D2	K
L
e	b
e

X2-DFN1010-3

Dim	Min	Max	Typ
A	-	0.40	0.39
A1	0.00	0.05	0.02
A3	-	-	0.13
b	0.18	0.28	0.23
D	0.95	1.05	1.00
D2	0.70	0.90	0.80
E	0.95	1.05	1.00
E2	0.36	0.56	0.46
e	-	-	0.50
K	-	-	0.20
L	0.195	0.295	0.245

All Dimensions in mm

Suggested Pad Layout

X2-DFN1010-3

X
	Y2
X1	Y1
G X

Y

C

X2-DFN1010-3

Dimensions	Value
C	0.500
G	0.150
X	0.330
X1	0.900
Y	0.445
Y1	0.505
Y2	0.200

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	20 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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