Документ: Packages_Diodes_Inc, страницы 251-255 | База учебных материалов

Package Outline Dimensions

TO220AB

E

E/2

	P
Q	Ø

D
D1	L2

	A
	A1
H1	H1
	D2
	E1

L1

A2

b2 L

b	c
b
e
e1

TO220AB

Dim	Min	Max	Typ
A	3.56	4.82	-
A1	0.51	1.39	-
A2	2.04	2.92	-
b	0.39	1.01	0.81
b2	1.15	1.77	1.24
c	0.356	0.61	-
D	14.22	16.51	-
D1	8.39	9.01	-
D2	11.45	12.87	-
e	-	-	2.54
e1	-	-	5.08
E	9.66	10.66	-
E1	6.86	8.89	-
H1	5.85	6.85	-
L	12.70	14.73	-
L1	-	6.35	-
L2	15.80	16.20	16.00
P	3.54	4.08	-
Q	2.54	3.42	-

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	251 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		TO220AB (Type C)
1.70	D
1.70	0.60		A3
	0.60		A3
		1.30
		H1
Y		ø	3°
			3°
		E	A
			A
		3°	3°
b1
			A2
		L
		L1
b

e e c

TO220AB

Type C

Dim	Min	Max	Typ
A	-	-	4.500
A2	-	-	2.400
A3	-	-	1.300
b	0.700	0.900	-
b1	-	-	1.270
c	0.400	0.600	-
D	9.800	10.20	-
E	9.00	9.40	-
e	-	-	2.54
H1	6.30	6.70	-
L	12.60	13.60	-
L1	9.60	10.60	-
Y	-	-	11.10
Ø	3.560	3.640	-

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	252 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

TO220AC

E

Q	P

D

L2

b2

L

e1

			A
					A1		TO220AC
					A1		TO220AC
						Dim	Min	Typ	Max
						Dim	Min	Typ	Max

						A	4.40	-	4.82

	H1
	H1					A1	1.1	-	1.40
						A1	1.1	-	1.40
						A2	2.05	-	2.92
						b	0.72	-	1.00
						b2	1.16	-	1.45
						c	0.36	-	0.68
						D	14.70	-	15.87
						D	14.70	-	15.87
						e1		5.08
						e1		5.08
		L1				E	9.80	-	10.26
						H1	5.80	-	6.40
						L	12.70	-	13.96
						L1	3.56	-	4.50
		c				P	3.70	-	3.90
		c				Q	2.54	-	3.30
b						Q	2.54	-	3.30
						All	Dimensions in mm
				A2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	253 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

TO220AC (13.7mm Min Lead Length)

	D
Q	P
	P
E1
L2	E
	O
	1
	.
	5
	0
	L1
b2
L
	e1

A
c2
A1
	b
c	e

TO220AC

(13.7mm Min Lead Length)

Dim	Min	Max	Typ
A	4.470	4.670	-
A1	2.520	2.820	-
b	0.710	0.910	0.813
b2	1.170	1.370	1.270
c	0.279	0.483	-
c2	1.170	1.370	-
D	10.010	10.310	-
E	8.763	9.017	8.890
E1	12.294	12.548	12.446
e		2.54BSC
e1	4.980	5.180	-
L	13.700	14.100	-
L1	4.04	4.19	4.11
L2	-	1.60	-
ØP	3.790	3.890	-
Q	2.642	2.946	2.743

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	254 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

										TO247
										A

												TO247
		H								B	Dim	Min		Max

											A	1.9		2.1
					J						B	4.85		5.15
S											B	4.85		5.15
											C	20.3		21.75
									C		C	20.3		21.75
									C		D	19.60		20.1
						K					E	2.2		2.6
						K					E	2.2		2.6
											G	0.51		0.76
											H	15.45		16.25
				L							H	15.45		16.25
P			Q	L							J	1.93		2.18


							G				K	2.9		3.2

									D
N											L	3.78		4.38
											L	3.78		4.38
											M	5.2		5.7
											M	5.2		5.7
											N	1.0		1.4

								E			P	1.8		2.2


											Q	2.8		3.2

	M		M
	M		M								S	4.4	Typ
											All	Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	255 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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