Документ: Packages_Diodes_Inc, страницы 206-210 | База учебных материалов

Package Outline Dimensions

X2-WLB2010-2

A1

A Seating Plane

Cathode	R	D
Notch		k
		k

	0
	.
	1
	0

E L

b2x

X2-WLB2010-2

Dim	Min	Max	Typ
A	−	0.305	0.290
A1	−	0.02	0.011
b	−	−	0.48
D	1.950	2.050	2.000
E	0.950	1.050	1.000
k	−	−	0.972
L	−	−	0.932

All Dimensions in mm

Suggested Pad Layout

X2-WLB2010-2

X

Y

Dimensions

Value (in mm)

G

0.872

X

0.580

G

X1

2.032

Y

1.032

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	206 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		X2-WLB2718-6
	D	e
1	2	e
1	2
PINID
A	C
		e
B	E B
C	A
	1	2
A1	A2
A1
	A
	SEATIN G
	PLANE

X2-WLB2718-6

Dim	Min	Max	Typ
A	−	0.40	0.35
A1	−	−	0.15
A2	−	−	0.20
b	0.25	0.35	0.30
D	1.75	1.80	1.79
E	2.65	2.70	2.69
e	−	−	0.65

All Dimensions in mm

Suggested Pad Layout

︶			X2-WLB2718-6
︶
D6x
	1	2
A
		C	Dimensions	Value
B			Dimensions	(in mm)
		C	C	0.65
		C	D	0.30
C			D	0.30
C
		C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	207 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X4-WLCUP0505-3

D

E

	L1
L	K
	L2
	b
	b
	K

				X4-WLCUP0505-3
	A1
	A1	A	Dim		Min	Max	Typ

			A		−	0.22	0.20
			A		−	0.22	0.20
			A1		0.006	0.001	0.008
			A1		0.006	0.001	0.008
			b		0.12	0.18	0.15
			b		0.12	0.18	0.15
SEATIN GPLANE			D		−	−	0.54
			E		−	−	0.54
			K		−	−	0.20
			L		0.47	0.53	0.50
			L1		0.12	0.18	0.15
			L2		0.12	0.18	0.15
			All		Dimensions in mm

Suggested Pad Layout

X4-WLCUP0505-3

X1

Y

Dimensions

Value

(in mm)

X

0.17

Y1

X1

0.54

Y

0.17

Y

Y1

0.54

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	208 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-WLCUP2010-2

A1

A Seating Plane

Cathode	R	D
Notch		k
		k

	0
	.
	1
	0

E L

b2x

X2-WLCUP2010-2

Dim	Min	Max	Typ
A	−	0.305	0.290
A1	−	0.02	0.011
b	−	−	0.48
D	1.950	2.050	2.000
E	0.950	1.050	1.000
k	−	−	0.972
L	−	−	0.932

All Dimensions in mm

Suggested Pad Layout

X2-WLCUP2010-2

X

Dimensions

Value (in mm)

G

0.872

Y

X

0.580

X1

2.032

Y

1.032

G

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	209 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X4-WLCUS0603-2

A A1

	D
	e
E	b (2X)
	b (2X)
	L (2x)

X4-WLCUS0603-2

Dim	Min	Max	Typ
A	-	-	0.20
A1	0.006	0.01	0.008
b	0.19	0.29	0.24
D	0.595	0.645	0.62
E	0.295	0.345	0.32
e	-	-	0.355
L	0.14	0.24	0.19

All Dimensions in mm

Suggested Pad Layout

X4-WLCUS0603-2

X1

X

Dimensions

Value (in mm)

C

0.380

Y

X

0.230

X1

0.610

Y

0.300

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	210 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

Смотрите также: