Документ: Packages_Diodes_Inc, страницы 196-200 | База учебных материалов

Package Outline Dimensions

Pin1	12

A
B
	D

	U-WLB1010-4
		︶
	21	b4x
	21
	A	e
E	B	e
	B
	A3

	A2	A
	A1	A
	A1

U-WLB1010-4

Dim	Min	Max	Typ
A	0.4535	0.5565	0.5050
A1	0.2115	0.2585	0.2350
A2	0.2200	0.2700	0.2450
A3	0.0220	0.0280	0.0250
b	0.2880	0.3520	0.3200
D	1.0300	1.0500	1.0400
e		0.500 BSC
E	1.0300	1.0500	1.0400

All Dimensions in mm

Suggested Pad Layout

U-WLB1010-4

︶

X4x

Dimensions

Value (in mm)

C

0.500

X

0.3200

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	196 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

A

D e

E

L1 L2

X2-WLB1406-2


		A1				X2-WLB1406-2
		A1				X2-WLB1406-2
			Seating Plane		Dim	Min	Max	Typ
					Dim	Min	Max	Typ
					A	0.27	0.35	0.30
					A	0.27	0.35	0.30
					A1	00	0.03	0.02
					A1	00	0.03	0.02
					b	0.459	0.559	0.509
		Z2			D	1.35	1.45	1.40
					D	1.35	1.45	1.40
					E	0.55	0.65	0.60
					E	0.55	0.65	0.60
					e	-	-	0.812
					e	-	-	0.812
					L1	0.194	0.294	0.244
	b2x				L1	0.194	0.294	0.244
	b2x				L2	0.700	0.800	0.750
				︶	L2	0.700	0.800	0.750
					Z1	0.016	0.076	0.046
					Z2	0.016	0.076	0.046
					Z2	0.016	0.076	0.046
	Z1				All	Dimensions in mm

Suggested Pad Layout

X2-WLB1406-2

X2

Dimensions

Value

(in mm)

X

0.334

Y

X1

0.840

X2

1.386

Y

0.589

X

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	197 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

A

R=10	D
R=10
b1
	L1 k L2

X3-WLB1406-2

	A1			X3-WLB1406-2

			Dim	Min	Max	Typ

		Seating Plane	A	0.250	0.300	0.275


			A1	0.000	0.015	-


			b	0.45	0.55	-
			b	0.45	0.55	-
			b1	0.45	0.55	-
			D	1.37	1.43	1.40
			D	1.37	1.43	1.40
			E	0.57	0.63	0.60
			E	0.57	0.63	0.60
			k	-	-	0.30
bE			k	-	-	0.30

			L1	0.20	0.26	-
			L1	0.20	0.26	-
			L2	0.70	0.80	-
			L2	0.70	0.80	-

			All	Dimensions in mm

Suggested Pad Layout

X3-WLB1406-2

X2

	Dimensions	Value
		Value
		(in mm)


	X	0.304
Y
Y	X1	0.840

	X2	1.352
	Y	0.580

X X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	198 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X3-WLB1408-2

A1

A

Seating Plane

D

Pin#1Cathode

Z2

e

Notch R0.10

E		︶
		b2x
L	L1	Z1
Cathode	Anode

Suggested Pad Layout

X3-WLB1408-2

X2

Y

X X1

X3-WLB1408-2

Dim	Min	Max	Typ
A	0.25	0.30	0.275
A1	-	0.01	-
b	0.659	0.759	0.709
D	1.35	1.45	1.40
E	0.75	0.85	0.80
e	-	-	0.855
L	0.194	0.294	0.244
L1	0.615	0.715	0.665
Z1	0.16	0.076	0.046
Z2	0.16	0.076	0.046

All Dimensions in mm

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	X	0.334
	X1	0.755
	X2	1.386
	Y	0.789

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	199 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-WLB1510-6

D Øb (x6)

e

U-WLB1510-6

E

Dim

Min

Max

Typ

D

0.90

1.00

e

E

1.40

1.50

A

−

0.62

−

A2

−

0.38

e

b

0.27

0.37

0.32

e

−

0.50

All

Dimensions in mm

A2

A

Seating Plane

Suggested Pad Layout

U-WLB1510-6

D
	Dimensions	Value
	Dimensions	(in mm)
C1	C	(in mm)
C1	C	0.50
C	C1	1.00
	D	0.25
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	200 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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