Документ: Packages_Diodes_Inc, страницы 246-250 | База учебных материалов

Package Outline Dimensions

SIP-5

C	K
a1	E

a2		I
a2	H
	H	L
	D	L
		45°

A B

F 45°

J

SIP-5

Dim	Min	Max
A	5.12	5.32
B	4.10	4.30
C	3.55	3.75
D	0.38	0.44
E	0.35	0.41
F	0.92	0.98
H	1.32	1.52
I	1.45	1.65
J	0.00	0.2
K	13.00	15.5
L	0.63	0.83
a1	3°	5°
a2	5°	7°

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	246 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		TO126
D		A
D	A2
E	Y	h
E	ø
	ø
b2
	L1
	b
L

e	c
	c
e1

TO126

Dim	Min	Max	Typ
A	2.400	2.900	-
A2	1.060	1.500	-
b	0.660	0.860	-
b2	1.170	1.470	-
c	0.400	0.600	-
D	7.400	8.200	-
E	10.60	11.20	-
e	-	-	2.280
e1	-	-	4.560
h	0.00	0.30	-
L	14.50	15.90	-
L1	1.700	2.100	-
Y	3.600	3.900	-
ø	3.100	3.550	-

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	247 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

D

TO220-3

												TO220-3
	E					ØP		A		F	Dim	Min	Max
								A


Q										PLANE	A	3.55	4.85
											A	3.55	4.85
							D1				b	0.51	1.14



										SEATING	b1	1.14	1.78


											D1	5.84	6.86
											C	0.31	1.14
											D	14.20	16.50

											E	9.70	10.70
			L1								e	2.79	2.99
			L1								e	2.79	2.99

b1											e1	4.83	5.33
					L						F	0.51	1.40

											J1	2.03	2.92
							C				L	12.72	14.72
											L1	3.66	6.35
				b							L1	3.66	6.35
		e									P	3.53	4.09
		e							J1
									J1
											Q	2.54	3.43
	e1										Q	2.54	3.43
	e1										All Dimensions in mm
											All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	248 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

E ØP Q

D

L1

b1

L

b

e

e1

TO220-5

					TO220-5
	A				TO220-5
			F	Dim	Min		Max
			PLANE	A	3.55		4.85
			PLANE	b1	1.14		1.78
D1			SEATING	b	0.51		1.14



				C	0.31		1.14
				D	14.20		16.50
				D	14.20		16.50
				D1	5.84		6.86
				E	9.78		10.54
				E	9.78		10.54
				e	1.6		1.8
				e1	6.6		7.0
				F	0.51		1.40
				J1	2.03		2.92
				L	12.72		14.72
C				L1	3.66		6.35
				P	3.53		4.09
		J1		P	3.53		4.09
		J1		Q	2.54		3.43
				All	Dimensions	in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	249 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

			TO220-5(R)
E	ØP	A	A1
Q		H1
		H1
D
D1			L1
			H2
			H3
		L	A2
		L
e	b	c
	b
		A3
		A3
		A4

TO220-5(R)

Dim	Min	Typ	Max
A	4.37	4.57	4.77
A1	1.12	1.27	1.40
A2	2.45	2.65	2.85
A3	4.10	4.40	4.70
A4	7.95	8.25	8.55
b	0.64	0.79	0.94
c	0.35	0.38	0.55
D	14.80	15.00	15.20
D1	8.50	8.70	8.90
e	-	1.70	-
E	9.96	10.16	10.36
H1	6.10	6.30	6.50
H2	21.32	22.12	22.92
H3	24.15	24.95	25.75
L	-	6.30	-
L1	13.10	13.50	13.90
P	3.64	3.84	4.04
Q	2.55	2.75	2.95

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	250 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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