Документ: Packages_Diodes_Inc, страницы 241-245 | База учебных материалов

Package Outline Dimensions

												PBU

				A										PBU
				A										PBU
					C								Dim	Min	Max
				B	C				M				A	22.70	23.70


													B	3.80	4.10
													B	3.80	4.10

							D						C	4.20	4.70


													D	1.70	2.20
													D	1.70	2.20
K	L												E	10.30	11.30
													E	10.30	11.30
			- ~ ~		+			E					G	4.50	6.80

													H
														4.80	5.80
														4.80	5.80
													J	25.40	-
										N			J	25.40	-
										N			K	-	19.30
	J												K	-	19.30
	J												L	16.80	17.80
													L	16.80	17.80
											P		M	6.60	7.10
													N
						G								4.70	5.20
														4.70	5.20
													P	1.20	1.30
		H

													All	Dimensions in mm
													All	Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	241 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	A
B
	G
	C
K	N
K
H	D
	F

			PDIP-8

					PDIP-8
				Dim	Min	Max
				A	9.02	9.53
				B	6.15	6.35
				C	3.10	3.50
				D	0.36	0.56
	L			F	1.40	1.65
				G	2.54	typ.
M				G	2.54	typ.
M				H	0.71	0.97
				J	0.20	0.36
				K	2.92	3.81
				K	2.92	3.81
				L	7.62	8.26
				L	7.62	8.26
		J		M	-	15°

				N	0.38	(min)
				All	Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	242 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SIP-3 (Ammo Pack)

SIP-3

(Ammo Pack)

Dim

Min

Max

D

N

A

3.9

4.3

E F

C

a1

45° Typ

a2

3° Typ

A

B

2.8

3.2

G

C

1.40

1.60

a1

D

0.35

0.41

a2

E

0.43

0.48

F

0

0.2

B

P

G

2.4

2.9

N

0.63

0.84

P

1.55

-

All

Dimensions

in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	243 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SIP-3 (Bulk Pack)

a	L
a
1		J
		J

a
2
B	P	D
		D

A

G H

E

F

N	C
N
3
a	a4
	a4

SIP-3

(Bulk Pack)

Dim	Min	Max
A	3.9	4.3
a1	5°	Typ
a2	5° Typ
a3	45° Typ
a4	3° Typ
B	2.8	3.2
C	1.40	1.60
D	0.33	0.432
E	0.40	0.508
F	0	0.2
G	1.24	1.30
H	2.51	2.57
J	0.35	0.43
L	14.0	15.0
N	0.63	0.84
P	1.55	-

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	244 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

︶
a12x	L
A
︶	S
︶
a22x
E	b2
E
DJ
	L1 F

c

b1

e1

SIP-4

							SIP-4
						Dim	Min	Max	Typ
						A	1.45	1.65	1.55
						b1	0.38	0.44	0.40
						b2	-	-	0.48
						c	0.35	0.45	0.40
						D	5.12	5.32	5.22
						e1	1.24	1.30	1.27
				2
			x			E	3.55	3.75	3.65
		5


		4				F	0.00	0.20	-
		.
		°
0
		3x				J	4.10	4.30	4.20
		3x				L	14.00	14.60	14.30
						L	14.00	14.60	14.30
						L1	1.32	1.52	1.42
						L1	1.32	1.52	1.42
						S	0.63	0.83	0.73
	︶				︶	a1	-	5°	3°
	︶				︶	a1	-	5°	3°
a32x			a42x			a2	4°	7°	5°
a32x			a42x			a2	4°	7°	5°
						a3	4°	7°	5°
						a4	-	5°	3°
						a4	-	5°	3°
						All	Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	245 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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