Документ: Packages_Diodes_Inc, страницы 166-170 | База учебных материалов

Package Outline Dimensions

SOT963

		D

		e1
						L		SOT963


							Dim	Min		Max	Typ
							A	0.40		0.50	0.45
E1				E			A1	0		0.05	-
E1				E			c	0.120		0.180	0.150
							c	0.120		0.180	0.150
							D	0.95		1.05	1.00
							E	0.95		1.05	1.00

							E1	0.75		0.85	0.80
							E1	0.75		0.85	0.80
	e		b (6 places)		c		L	0.05		0.15	0.10
			b (6 places)		c		b	0.10		0.20	0.15
							b	0.10		0.20	0.15
							e		0.35 Typ

				A			e1		0.70 Typ
							e1		0.70 Typ
A1							All	Dimensions in mm
							All	Dimensions in mm

Suggested Pad Layout

SOT963

C					C
C					C

Dimensions

Value

(in mm)

C

0.350

Y1

X

0.200

Y

0.200

Y (6X)

Y1

1.100

X(6X)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	166 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	D1	0
		0
		2
		.
		0
		R
E		1H
E
B1	B	L
	e
	8° (4X)

A

D

SOT89

	C
			SOT89
			SOT89
		Dim	Min		Max
		Dim	Min		Max
		A	1.40		1.60
H		A	1.40		1.60
H		B	0.44		0.62
		B	0.44		0.62
		B1	0.35		0.54
		C	0.35		0.44
		D	4.40		4.60
		D	4.40		4.60
		D1	1.62		1.83
		D1	1.62		1.83
		E	2.29		2.60
		e	1.50	Typ
		H	3.94		4.25
		H1	2.63		2.93
		L	0.89		1.20
		All	Dimensions	in mm

Suggested Pad Layout

SOT89

X1

X2

(2x)

Dimensions

Value (in mm)

X

0.900

X1

1.733

Y1

Y3

Y4

X2

0.416

Y

1.300

Y1

4.600

Y2

Y

Y2

1.475

Y3

0.950

C

Y4

1.125

X (3x)

C

1.500

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	167 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	D1	0
	D1	2
		.
		0
		R
		L
E
		L
B1	B
	B
	e
	8°4x
	︶
		A
	D

SOT89-5

C

H

SOT89-5

Dim	Min	Max	Typ
A	1.40	1.60	1.50
B	0.50	0.62	0.56
B1	0.44	0.54	0.48
C	0.35	0.43	0.38
D	4.40	4.60	4.50
D1	1.62	1.83	1.733
E	2.40	2.60	2.50
e	-	-	1.50
H	3.95	4.25	4.10
L	0.65	0.95	0.80

All Dimensions in mm

Suggested Pad Layout

			SOT89-5
	C
			Dimensions	Value
			Dimensions	(in mm)
	C1		C	(in mm)
	C1		C	1.500
	X2		C1	1.050
	X2		X	0.680
Y3			X	0.680
Y3	Y2		X1	0.760
	Y2	Y1	X2	1.930
			X3	3.680
			Y	1.200
			Y1	1.200
Y			Y2	4.250
Y	X1		Y3	4.500
	X1	X	Y3	4.500
		X
	X3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	168 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

E2a
	P
Q	Ø
Q
E2	1
	P
DQ1	Ø
DQ1
	D1

	TO220AB
	A
	A1
H1	01
H1
	01

L1

A2

b2 L

	b	c
	b
e
	e1
0	︶
22x

E

TO220AB

Dim	Min	Max	Typ
A	4.40	4.70	4.57
A1	1.22	1.33	1.27
A2	2.59	2.79	2.69
b	0.77	0.90	0.813
b2	1.20	1.36	1.27
c	0.340	0.470	0.381
D	14.70	15.30	15.00
D1	8.60	8.80	8.70
e		2.54 BSC
e1	5.08 BSC
E	10.00	10.20	10.10
E2	10.06	10.26	10.16
E2a	10.10	10.35	10.25
H1	6.10	6.50	6.30
L	13.20	13.50	13.40
L1	-	4.00	3.75
Q	2.60	2.90	2.743
Q1		2.50 REF
ØP	3.76	3.88	3.84
ØP1	1.40	1.60	1.50
θ1	5°	9°	7°
θ2	1°	5°	3°

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	169 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	D
Q	P
	P
E1
L2	E
	O
	1
	.
	5
	0
	L1
b2
L
	e1

	TO220AC
A
c2
A1
	b
c	e

TO220AC

Dim	Min	Max	Typ
A	4.470	4.670	-
A1	2.520	2.820	-
b	0.710	0.910	0.813
b2	1.170	1.370	1.270
c	0.279	0.483	-
c2	1.170	1.370	-
D	10.010	10.310	-
E	8.763	9.017	8.890
E1	12.294	12.548	12.446
e		2.54BSC
e1	4.980	5.180	-
L	13.700	14.100	-
L1	4.04	4.19	4.11
L2	-	1.60	-
ØP	3.790	3.890	-
Q	2.642	2.946	2.743

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	170 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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