Документ: Packages_Diodes_Inc, страницы 161-165 | База учебных материалов

Package Outline Dimensions

SOT543

D e1

SOT543

E1/2

E/2

Dim

Min

Max

Typ

A

0.55

0.60

E1

E

b

0.15

0.30

0.20

e

c

0.10

0.18

0.15

D

1.50

1.70

1.60

L

E

1.55

1.70

1.60

E1

1.10

1.25

1.20

L1

b

c

e

0.50 BSC

R0.1 MAX.

e1

1.00 BSC

TYP.

a

L

0.10

0.30

0.20

L1

0.06

0.10

0.08

a

6°

8°

7°

A

All

Dimensions in mm

7°

TYP.

Suggested Pad Layout

SOT543

C

Dimensions

Value

Y2

(in mm)

C

0.500

X

0.300

Y

0.670

Y

Y1

0.550

Y2

1.940

Y1

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	161 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT553

D e1


												SOT553
	E1/2			e		E/2					Dim	Min	Max	Typ
											A	0.55	0.62	0.60
											A	0.55	0.62	0.60
E1								E			b	0.15	0.30	0.20
											c	0.10	0.18	0.15


											D	1.50	1.70	1.60

										L (5x)	E	1.55	1.70	1.60
			F			b (5x)			c		E1	1.10	1.25	1.20
											E1	1.10	1.25	1.20
											e	0.50 BSC

	R0.1 MAX.										e1	1.00 BSC
		TYP.					a				F	0.00	0.10	––
											L	0.10	0.30	0.20
											L	0.10	0.30	0.20
											a	6°	8°	7°
							A				All	Dimensions in mm




					°
					°
					7
							TYP.

Suggested Pad Layout

SOT553

C2

Dimensions

SOT553

Z

2.2

G

1.2

G

C1

X

0.375

Z

Y

0.5

C1

1.7

Y

C2

0.5

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	162 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT563

	A							SOT563
	A



							Dim	Min	Max	Typ
			B	C			Dim	Min	Max	Typ
			B	C			A	0.15	0.30	0.20
							B	1.10	1.25	1.20
							C	1.55	1.70	1.60
							C	1.55	1.70	1.60
		D					D	-	-	0.50
							D	-	-	0.50
							G	0.90	1.10	1.00

	G

							H	1.50	1.70	1.60
							H	1.50	1.70	1.60
							K	0.55	0.60	0.60
						M	L	0.10	0.30	0.20
							L	0.10	0.30	0.20
K							M	0.10	0.18	0.11

							All	Dimensions in mm

	H				L
					L

Suggested Pad Layout

SOT563

C2

Dimensions

SOT563

Z

2.2

G

1.2

X

0.375

G

C1

Y

0.5

Z

C1

1.7

C2

0.5

Y

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	163 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

							SOT666

	A								SOT666
	A



								Dim	Min	Max	Typ
			B	C				A	0.15	0.30	0.20
								B	1.10	1.25	1.20
								B	1.10	1.25	1.20
								C	1.55	1.70	1.60
								C	1.55	1.70	1.60
		D						D	-	0.50	-
								D	-	0.50	-
								G	0.90	1.10	1.00

	G

								H	1.50	1.70	1.60


								K	0.55	0.60	0.60

						M		L	0.10	0.30	0.20
K								L	0.10	0.30	0.20
K								M	0.10	0.18	0.15


								All	Dimensions in mm
	H				L
					L

Suggested Pad Layout

SOT666

C

Y

(6x)

Dimensions

Value (in mm)

C

0.50

G

0.80

X

0.35

Y

0.50

X

(6x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	164 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

						SOT953
		D

		e1
							L			SOT953



								Dim		Min		Max	Typ
								A	0.40		0.50		0.45
								A	0.40		0.50		0.45
E1				E				A1	0		0.05		-
E1				E				b	0.10		0.20		0.15
								b	0.10		0.20		0.15
								c		0.12		0.18	0.15
								D	0.95		1.05		1.00
								D	0.95		1.05		1.00
					c			E	0.95		1.05		1.00
	e		b (5 places)		c			E1	0.75		0.85		0.80
			b (5 places)					e	-		-		0.35
								e	-		-		0.35
								e1	-		-		0.70
								e1	-		-		0.70
				A				L	0.05		0.15		0.10
A1				A				All Dimensions in mm
								All Dimensions in mm

Suggested Pad Layout

SOT953

C				C
C				C

Dimensions

Value

(in mm)

C

0.350

Y1

X

0.200

Y

0.200

Y (5X)

Y1

1.100

X(5X)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	165 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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