Документ: Packages_Diodes_Inc, страницы 156-160 | База учебных материалов

Package Outline Dimensions

SC59

	A
	A								SC59
									SC59

								Dim	Min	Max	Typ
								A	0.35	0.50	0.38
								A	0.35	0.50	0.38
			B		C			B	1.50	1.70	1.60
			B		C			B	1.50	1.70	1.60
								C	2.70	3.00	2.80

								D	-	-	0.95

								G	-	-	1.90
	G


	H							H	2.90	3.10	3.00
								H	2.90	3.10	3.00
								J	0.013	0.10	0.05


K							M	K	1.00	1.30	1.10
K								K	1.00	1.30	1.10
				N				L	0.35	0.55	0.40
								L	0.35	0.55	0.40
								M	0.10	0.20	0.15
J								M	0.10	0.20	0.15
		D				L		N	0.70	0.80	0.75
		D				L		N	0.70	0.80	0.75
								α	0°	8°	-
								α	0°	8°	-

								All	Dimensions in mm
								All	Dimensions in mm

Suggested Pad Layout

SC59

Y

Dimensions

SC59

Z

C

Z

3.4

X

0.8

Y

1.0

C

2.4

E

1.35

X

E

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	156 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT523

	A
	A
									SOT523
								Dim	Min	Max	Typ
								Dim	Min	Max	Typ
								A	0.15	0.30	0.22
			B		C			A	0.15	0.30	0.22
			B		C			B	0.75	0.85	0.80
								B	0.75	0.85	0.80
								C	1.45	1.75	1.60
								C	1.45	1.75	1.60
								D	-	-	0.50
								D	-	-	0.50
	G
	G							G	0.90	1.10	1.00
	H							G	0.90	1.10	1.00
	H							H	1.50	1.70	1.60
								J	0.00	0.10	0.05

K							M
								K	0.60	0.80	0.75
				N
				N
								L	0.10	0.30	0.22
J								M	0.10	0.20	0.12
J		D				L		M	0.10	0.20	0.12
								N	0.45	0.65	0.50


								α	0°	8°	-
								α	0°	8°	-
								All Dimensions in mm
								All Dimensions in mm

Suggested Pad Layout

SOT523

Y

Dimensions

SOT523

Z

1.8

Z

C

X

0.4

Y

0.51

C

1.3

E

0.7

X

E

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	157 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT323

H

					SOT323
K				Dim	Min	Max	Typ
				A	0.25	0.40	0.30
		M	a	B	1.15	1.35	1.30
		M		C	2.00	2.20	2.10

J	D
	D	L		D	0.650 BSC
	A	L		D	0.650 BSC
	A			F	0.375	0.475	0.425
				G	1.20	1.40	1.30
				H	1.80	2.20	2.15
				J	0.00	0.10	0.05
				K	0.90	1.00	0.95
C		B		L	0.25	0.40	0.30
				M	0.10	0.18	0.11
				a		8°C
				All Dimensions in mm
	G

Suggested Pad Layout

SOT323

Y

Dimensions

SOT323

Z

2.8

Z

C

X

0.7

Y

0.9

C

1.9

E

1.0

X

E

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	158 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

H
K1K	J
K1K
A	M

SOT23

Al7°

L

CB

D

		SOT23
	Dim	Min	Max	Typ
	A	0.37	0.51	0.40
	B	1.20	1.40	1.30
	C	2.30	2.50	2.40
	D	0.89	1.03	0.915
a	D	0.89	1.03	0.915
a	F	0.45	0.60	0.535
	G	1.78	2.05	1.83
L1	H	2.80	3.00	2.90
	J	0.013	0.10	0.05
	K	0.890	1.00	0.975
	K1	0.903	1.10	1.025
	L	0.45	0.61	0.55
	L1	0.25	0.55	0.40
	M	0.085	0.150	0.110
	a		8°
	All	Dimensions in mm

Suggested Pad Layout

SOT23

Y

Dimensions

SOT23

Z

2.9

C

X

0.8

Y

0.9

C

2.0

E

1.35

X

E

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	159 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions
		SOT23F
		Seating
D		c
D		Plane
b		L1
		L1	Dim	SOT23F		Typ
			Dim	Min	Max	Typ
	E1	E	A	0.80	1.00	0.90
	E1	E	b	0.35	0.45	0.40
			c	0.06	0.16	0.11
			D	2.80	3.00	2.90
			e	-	-	0.95
			e1	-	-	1.90
e1			E	2.30	2.50	2.40
e			E1	1.50	1.70	1.60
e	R	A	k	1.10	1.26	1.18
L			k	1.10	1.26	1.18
			L	0.48	0.68	0.58
			L	0.48	0.68	0.58
			L1	0.39	0.41	0.40
	k		R	0.05	0.15	0.10
			All Dimensions in mm

Suggested Pad Layout

SOT23F

X C

Dimensions

Value (in mm)

C

0.95

X

0.80

Y1

Y

1.110

Y1

3.000

Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	160 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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