Документ: Packages_Diodes_Inc, страницы 236-240 | База учебных материалов

Package Outline Dimensions

KBP

L

KBP

A

K

Dim

Min

Max

J

M

A

14.25

14.75

B

10.20

10.60

_

B

C

1.80

2.20

+

D

14.25

14.73

N

E

3.56

4.06

G

0.76

0.86

H

C

H

1.17

1.42

J

2.8 X 45°

D

G

K

0.80

1.10

P

L

3.35

3.65

M

3° Typ

N

2° Typ

P

0.30

0.64

E

All

Dimensions

in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	236 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

MB

H

MB

B

Dim

Min

Max

E

A

28.40

28.70

B

10.97

11.23

C

15.50

17.60

E

22.86

25.40

A

G

13.30

15.30

C

H

Hole for #10 screw

4.85

5.59

(AC)

J

17.10

19.10

(+)

K

10.40

12.40

J

A

C

( - )

(AC)

L

0.97 Typ

1.07

M

30.50

-

N

10.97

11.23

G

All

Dimensions

in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	237 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

MB-W

			H
			H								MB-W
											MB-W
									Dim		Min	Max
	N								A	28.40		28.70
M									A	28.40		28.70
M									B	10.97		11.23
									B	10.97		11.23
					L				C		15.50	17.60
					L				E	22.86		25.40
									E	22.86		25.40
									G	13.30		15.30
									G	13.30		15.30
											Hole for #10 screw
			A						H		Hole for #10 screw
			A
			J				H				4.85	5.59


									J	17.10		19.10
									J	17.10		19.10
		(AC)
		(AC)		( + )					K	10.40		12.40


									L		0.97 Typ	1.07
	J							A	M	30.50		-
						K
						K			N	10.97		11.23


		( - )		(AC)					All	Dimensions		in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	238 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

PBPC-3 / PBPC-6

H

G

+

AC

PBPC-3 / PBPC-6

Dim

Min

Max

A

-

A

14.73

15.75

AC

B

5.84

6.86

E

C

19.00

-

E

D

0.76 Typ

E

1.70

3.20

D

Hole

for #6

C

G

screw

3.60

4.00

H

10.30

11.30

B

All

Dimensions

in mm

A

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	239 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

PBPC-8

J

H

+

PBPC-8

AC

Dim

Min

Max

G

A

18.54

19.56

A

B

6.35

7.60

AC

-

C

22.20

-

E

D

1.27 Typ

E

5.33

7.37

G

3.60

4.00

D

H

12.70

Typ

J

2.38 X 45° Typ

C

All

Dimensions in mm

B

A

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	240 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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