Документ: Packages_Diodes_Inc, страницы 46-50 | База учебных материалов

Package Outline Dimensions

X2-DFN2018-8

G

F

H

SIDE VIEW

			D	B
			D
			L3		C
		D	L3
		D	L4	L1
			L4	L1	D
A	E		L5	N	L2
			L6	N
			L6
		D
			M	K	D
			BOTTOM VIEW

X2-DFN2018-8

Dim	Min	Max	Typ
A	1.95	2.08	2.00
B	1.75	1.88	1.80
C	0.25	0.35	0.30
D	-	-	0.20
E	-	-	0.30
F	-	-	0.26
G	0.36	0.40	0.39
H	0	0.05	0.02
K	0.15	0.25	0.20
L1	0.40	0.60	0.50
L2	0.90	1.10	1.00
L3	0.50	0.70	0.60
L4	0.30	0.50	0.40
L5	0.25	0.45	0.35
L6	0.20	0.40	0.30
M	-	-	0.40
N	-	-	0.30

All Dimensions in mm

TOP VIEW

Suggested Pad Layout

X2-DFN2018-8

X

C

Dimensions

Value (in mm)

C

0.40

Y

G1

0.10

G2

0.20

G3

0.10

X3

Y3

X2

G4

0.20

X

0.25

G4

Y2

X1

0.60

X2

0.50

G1

X1

Y1

G2

X3

0.35

Y

0.50

Y1

0.40

Y2

1.00

Y3

0.30

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	46 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN2020-2

A1 A

Seating Plane

	D
Z14X	D1
︶	D1
︶	e
	Y	X
	Y
E		L2X
		︶
Z4X	K	b2X
︶		︶

U-DFN2020-2

Dim	Min		Max	Typ
A	0.545		0.605	0.575
A1	0		0.05	0.02
b	0.35		0.55	0.45
D	1.90		2.10	2.00
D1	1.70		1.90	1.80
E	1.90		2.10	2.00
e			1.35 BSC
K	0.80		1.00	0.90
L	1.70		1.90	1.80
X	-		-	0.120
Y	-		-	0.240
Z			0.10 BSC
Z1		0.10 BSC

All Dimensions in mm

Suggested Pad Layout

U-DFN2020-2

X

C

Dimensions

Value

(in mm)

C

1.350

G

0.800

Y

X

0.550

X1

1.900

Y

1.900

X G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	47 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN2020-3

AA1	A3

Seating Plane

D
D2	L
	L
R
0
.2
0
Pin#1ID	E3
E
E2
	D3
b	L
e

U-DFN2020-3

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.152
b	0.20	0.30	0.25
D	1.950	2.075	2.00
D2	1.10	1.30	1.20
D3		0.325 REF
e	-	-	0.50
E	1.950	2.075	2.00
E2	0.80	1.00	0.90
E3		0.138 REF
L	0.35	0.45	0.40

All Dimensions in mm

Suggested Pad Layout

				U-DFN2020-3
		X3
Y1		X1
Y1				0
		R		0
		50		.2
		0.	0
			R
				5
				.2
		X2		0
		X2		R
Y2		0		Y4
G		.2
G		0
	R
			Y3
Y
X		C
		C

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	1.000
	G	0.150
	X	0.350
	X1	0.450
	X2	1.400
	X3	1.724
	Y	0.600
	Y1	0.450
	Y2	1.100
	Y3	0.450
	Y4	2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	48 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

A	A3
A
A1
	D
Z	D2
Z
D4	L
D4
E E2
E4
e	b
e	e

U-DFN2020-3 (Type B)

		U-DFN2020-3
		Type B
SEATING PLANE	Dim	Min	Max	Typ
SEATING PLANE	A	0.57	0.63	0.60
	A1	0	0.05	0.02
	A3	-	-	0.152
	b	0.20	0.30	0.25
	D	1.95	2.075	2.00
	D2	1.22	1.42	1.32
	D4	0.56	0.76	0.66
	e	-	-	0.65
	E	1.95	2.075	2.00
	E2	0.79	0.99	0.89
	E4	0.48	0.68	0.58
	L	0.25	0.35	0.30
	Z	-	-	0.225
	All	Dimensions in mm

Suggested Pad Layout

U-DFN2020-3 (Type B)

X

Y1

Dimensions

Value

(in mm)

C

1.30

Y

G

0.24

X

0.35

X1

1.52

G

Y

1.09

X1

Y1

0.47

C

Y2

0.50

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	49 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Suggested Pad Layout

V-DFN2020-3

C

X (3x)

Dimensions

Value

(in mm)

Y (2x)

C

0.65

G

0.20

G

X

0.35

Y4

Y3

Y1

X1

1.52

Y

0.55

Y1

0.98

Y2

0.47

Y3

0.63

X1

Y4

2.20

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	50 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

Смотрите также: