Документ: Packages_Diodes_Inc, страницы 36-40 | База учебных материалов

Package Outline Dimensions

X2-DFN1310-6

A	A1	A3

Seating Plane

		D
		D2		f
	z b f			f
	z b f
R
0
	.1
	5
	0			E2
EPin#1ID				E2
EPin#1ID
				d
				L
f		f d	z
f		e

X2-DFN1310-6

Dim	Min	Max	Typ
A	-	0.40	-
A1	0	0.05	0.02
A3	-	-	0.13
b	0.10	0.20	0.15
D	1.25	1.38	1.30
d	-	-	0.25
D2	0.30	0.50	0.40
E	0.95	1.075	1.00
e	-	-	0.35
E2	0.30	0.50	0.40
f	-	-	0.10
L	0.20	0.30	0.25
Z	-	-	0.05

All Dimensions in mm

Suggested Pad Layout

X2-DFN1310-6

G2

X2

Dimensions

X2- DFN1310-6

G1

0.16

Y2

G2

0.17

G1

G3

0.15

X1

0.52

b

X2

0.20

Y1

0.52

Y2

0.375

a

0.09

a

b

0.06

X1

G3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	36 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN1616-6

	A
	A
							A3
							A3

			A1
									U-DFN1616-6
					D
					D
								Dim	Min	Max	Typ
								A	0.545	0.605	0.575
				e

								A1	0	0.05	0.02
								A1	0	0.05	0.02
								A3	-	-	0.13
								b	0.20	0.30	0.25
								b	0.20	0.30	0.25
E		E2						D	1.55	1.675	1.60
E		E2						D	1.55	1.675	1.60
								D2	1.10	1.30	1.20
								D2	1.10	1.30	1.20
								E	1.55	1.675	1.60
								E	1.55	1.675	1.60

						L		e	-	-	0.50
						L		e	-	-	0.50
					b			E2	0.30	0.50	0.40
					b			L	0.275	0.375	0.325
								L	0.275	0.375	0.325

								All	Dimensions in mm
					D2
					D2

Suggested Pad Layout

U-DFN1616-6

Y

C

Dimensions

Value (in mm)

X2

Z

1.3

G

0.175

X1

0.50

X1

X2

0.525

Y

0.30

C

0.50

Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	37 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN1616-6 (Type E)

		A1	A3
	A
		D
		D2
		b1
E	E2	L1
		L(2X)
	Z(4X)	e
	Z(4X)	b(6X)

X1-DFN1616-6

Type E

Dim	Min	Max	Typ
A	0.47	0.53	0.50
A1	0	0.05	0.02
A3	—	—	0.13
b	0.20	0.30	0.25
b1	0.10	0.30	0.20
D	1.55	1.65	1.60
D2	0.57	0.77	0.67
E	1.55	1.65	1.60
E2	1.30	1.50	1.40
e	—	—	0.50
L	0.25	0.35	0.30
L1	0.52	0.72	0.62
Z	—	—	0.175

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	38 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X1-DFN1616-6 (Type E)

		A1	A3
	A
		D
		D2
		b1
E	E2	L1
		L(2X)
	Z(4X)	e
	Z(4X)	b(6X)

X1-DFN1616-6

Type E

Dim	Min	Max	Typ
A	0.47	0.53	0.50
A1	0	0.05	0.02
A3	—	—	0.13
b	0.20	0.30	0.25
b1	0.10	0.30	0.20
D	1.55	1.65	1.60
D2	0.57	0.77	0.67
E	1.55	1.65	1.60
E2	1.30	1.50	1.40
e	—	—	0.50
L	0.25	0.35	0.30
L1	0.52	0.72	0.62
Z	—	—	0.175

All Dimensions in mm

Suggested Pad Layout

X1-DFN1616-6 (Type E)

X3

Y (2x)

Dimensions

Value

(in mm)

C

0.500

X

0.300

Y1

X1

0.200

Y2

X2

0.720

X2

X1

X3

0.400

Y

0.475

Y1

0.620

Y2

1.900

X (6x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	39 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN1616-6 (Type F)

A1 A3 A

Seating Plane

	D
	D1	D22X
		D22X
Pin#1ID		︶
E	R	E22x
	0	︶
	.	︶
	1
K	0
K
	e	L
Z4x	b	L
︶

U-DFN1616-6

Type F

Dim	Min	Max	Typ
A	0.45	0.55	0.50
A1	0	0.05	0.02
A3	—	—	0.127
b	0.20	0.30	0.25
D	1.55	1.65	1.60
D1	1.14	1.34	1.24
D2	0.38	0.58	0.48
E	1.55	1.65	1.60
E2	0.54	0.74	0.64
e	—	—	0.50
K	—	—	0.23
L	0.15	0.35	0.25
Z	—	—	0.175

All Dimensions in mm

Suggested Pad Layout

	U-DFN1616-6 (Type F)
	X2
	G1
			Dimensions	Value (in mm)
			C	0.500
	X1		G	0.150
	X1		G1	0.180
Y1	G	Y2	X	0.320
	G		X1	0.580
			X1	0.580
			X2	1.320
			Y	0.450
Y			Y1	0.700
Y			Y	1.900
			Y	1.900
	C
	X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	40 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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