Документ: Packages_Diodes_Inc, страницы 56-60 | База учебных материалов

Package Outline Dimensions

U-DFN2020-6 (Type F)

A

A1A3

Seating Plane

	D
E3	D3
	D3
E		D2	E2
E			E2
e2			L
e2
Z1
	e	b
Z4X
︶

U-DFN2020-6

(Type F)

Dim	Min		Max	Typ
A	0.57		0.63	0.60
A1	0		0.05	0.03
A3	-		-	0.15
b	0.25		0.35	0.30
D	1.95		2.05	2.00
D2	0.85		1.05	0.95
D3	0.33		0.43	0.38
e			0.65 BSC
e2		0.863 BSC
E	1.95		2.05	2.00
E2	1.05		1.25	1.15
E3	0.65		0.75	0.70
L	0.225		0.325	0.275
Z			0.20 BSC
Z1		0.110 BSC

All Dimensions in mm

Suggested Pad Layout

U-DFN2020-6 (Type F)

X3

Y

C

X

Dimensions

Value

(in mm)

C

0.650

X

0.400

X1

0.480

X2

0.950

Y3Y2

Y1Y4

X3

1.700

Y

0.425

X1

Y1

0.800

Y2

1.150

Pin1

Y3

1.450

Y4

2.300

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	56 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		X2-DFN2020-6			X2-DFN2020-6
					X2-DFN2020-6
		A1	A3	Dim	Min	Max	Typ
			A3	A	−	0.40	−
A
A
				A1	0	0.05	0.03
	D			A3	−	−	0.13
	D			b	0.25	0.35	0.30
	e			b	0.25	0.35	0.30
				D	1.95	2.05	2.00
		L		D2	0.85	1.05	0.95
		L		E	1.95	2.05	2.00
				E	1.95	2.05	2.00
	D2			E2	1.40	1.60	1.50
	D2			e	−	−	0.65
EE2				e	−	−	0.65
EE2				L	0.25	0.35	0.30
		L1		L1	1.35	1.45	1.40
				Z	−	−	0.20
︶		︶		All Dimensions in mm
︶		︶
Z3X	e	b6X

Suggested Pad Layout

X2-DFN2020-6

X2

X1

Dimensions

Value

Y

(in mm)

C

0.650

X

0.400

X1

1.050

Y3

Y2

X2

1.700

Y

0.500

Y1

1.600

Y2

1.600

Y3

2.300

X (6x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	57 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Suggested Pad Layout

U-DFN2020-8

X3

X

C

Value

Y

G

Dimensions

(in mm)

C

0.500

X1

G

0.150

X

0.350

Y2Y1

X1

0.700

X2

1.660

Y

0.490

Y1

1.020

Y1

2.300

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	58 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

W-DFN2020-8 (Type C)

A A1

A3Seating Plane

	*D
	D2
	D/2
		K
Pin#1ID
E	R	E/2
E		E2
		E2
	0
	.
	2
	0
L
	e b

W-DFN2020-8

Type C

Dim	Min	Max	Typ
A	0.770	0.830	0.800
A1	0	0.05	0.02
A3	-	-	0.152
b	0.20	0.30	0.25
D	1.950	2.075	2.000
D2	1.50	1.70	1.60
E	1.950	2.075	2.000
E2	0.80	1.00	0.90
e	-	-	0.50
K	-	-	0.125
L	0.240	0.340	0.290

All Dimensions in mm

Suggested Pad Layout

W-DFN2020-8

	X2	Y
	G	Y
	G

			Dimensions Value (in mm)
			C	0.500
			G	0.200
			G1	0.210
Y2Y1		G1	X	0.300
		G1	X1	1.600
			X1	1.600
	X1		X2	1.750
			Y	0.490
			Y1	0.900
			Y2	2.300
X	C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	59 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN2030-6 (Type B)

A1			A3
			A3
A			Seating Plane
			Seating Plane
		D
		e

Pin#1ID
E			E2
	D2		L
	D2
︶			b
Z4x

U-DFN2030-6

Type B

Dim	Min	Max	Typ
A	0.55	0.65	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.25	0.35	0.30
D	1.95	2.05	2.00
D2	1.40	1.60	1.50
E	2.95	3.05	3.00
E2	1.74	1.94	1.84
e	-	-	0.65
L	0.28	0.38	0.33
Z	-	-	0.20

All Dimensions in mm

Suggested Pad Layout

U-DFN2030-6 (Type B)

X2

G

X1 Y2

Y
Y



	Dimensions	Value
	Dimensions	Value
		(in mm)
	C	0.650
	G	0.150
	X	0.400
Y1	X	0.400
Y1	X1	1.600
	X2	1.700
	Y	0.530
	Y1	1.940
	Y1	1.940
	Y2	3.300

CX

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	60 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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