Документ: Packages_Diodes_Inc, страницы 41-45 | База учебных материалов

Package Outline Dimensions

U-DFN1616-8


	A

							A3				U-DFN1616-8


			A1
			A1							Dim	Min	Max	Typ

										A	0.545	0.605	0.575
					D					A1	0	0.05	0.02
					D

										A3	-	-	0.13
				e
				e
								L		b	0.15	0.25	0.20
								L		D	1.55	1.675	1.60
										D	1.55	1.675	1.60
										D2	0.35	0.55	0.45
										D2	0.35	0.55	0.45
		E2								E	1.55	1.675	1.60
E									D2

										e	-	-	0.40
										e	-	-	0.40
										E2	0.90	1.10	1.00

										L	0.25	0.35	0.30
										L	0.25	0.35	0.30

										All	Dimensions in mm
				e
						b
						b

Suggested Pad Layout

U-DFN1616-8

X2

a

G2

Dimensions

Value (in mm)

G1

0.15

Y2

G2

0.20

X1

0.65

X2

0.25

Y1

1.25

Y1

G1

Y2

0.50

C

0.40

a

0.10

X1

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	41 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN2015-3

A3

A

SEATING PLANE

A1
D
z
e	L
E	E2
D2
	b

X2-DFN2015-3

Dim	Min	Max	Typ
A	-	0.40	-
A1	0	0.05	0.02
A3	-	-	0.13
b	0.20	0.30	0.25
D	1.45	1.575	1.5
D2	1.00	1.20	1.10
e	-	-	0.50
E	1.95	2.075	2.00
E2	0.70	0.90	0.80
L	0.25	0.35	0.30
z	-	-	0.125

All Dimensions in mm

Suggested Pad Layout

X2-DFN2015-3

X

Y1

Y2

X1

	︶
G	Y2x
G

C

X2-DFN2015-3

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	1.000
	G	0.150
	X	0.310
	X1	1.300
	Y	0.500
	Y1	0.650
	Y2	1.000

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	42 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN2015-6

	A1
		A3
A			Seating Plane
A

		D	L
z			L
z
R
	0
	.2
	0
Pin#1ID

E		D2	E2
		D2
z1
		e	b

X2-DFN2015-6

Dim	Min	Max	Typ
A	0.375	0.40	0.390
A1	0	0.05	0.02
A3	-	-	0.13
b	0.20	0.30	0.25
D	1.45	1.575	1.50
D2	1.00	1.20	1.10
e	-	-	0.50
E	1.95	2.075	2.00
E2	0.70	0.90	0.80
L	0.25	0.35	0.30
Z	-	-	0.125
Z1	-	-	0.075

All Dimensions in mm

Suggested Pad Layout

X2-DFN2015-6

X2

X

C

X2-DFN2015-6

Y

Dimensions

Value

(in mm)

C

0.500

X

0.350

X1

1.150

Y1

Y2

X2

1.350

Y

0.500

Y1

0.850

Y2

2.150

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	43 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

										X2-DFN2015-8
														X2-DFN2015-8


	A											A3	Dim		Min	Max	Typ
	A												Dim		Min	Max	Typ
													D		1.95	2.05	2.00
									A1				D		1.95	2.05	2.00
				SIDE VIEW									E		1.45	1.55	1.50


					D								D1		0.23	0.43	0.33
					D1								E1		0.55	0.75	0.65
													D2		0.52	0.72	0.62

											L		E2		0.38	0.58	0.48
											L		E2		0.38	0.58	0.48
						E1							D3		0.40	0.60	0.50
													D3		0.40	0.60	0.50
													E3		0.35	0.55	0.45
													E3		0.35	0.55	0.45
E	E2		D2					D3			E3		A		-	0.40	0.39
								D3					A1		0	0.05	0.02



													A3		-	-	0.127
													A3		-	-	0.127
													b		0.20	0.30	0.25
													b		0.20	0.30	0.25
													L		0.25	0.35	0.30
													L		0.25	0.35	0.30
													e		-	-	0.65
		Z		e			b						e		-	-	0.65
				e									Z		-	-	0.225
				BOTTOM VIEW

													All Dimensions in mm
													All Dimensions in mm

Suggested Pad Layout

X2-DFN2015-8

C

X1 (4x)

X

Dimensions

Value (in mm)

C

0.650

Y1 (4x)

G

0.150

Y

G1

0.150

G (4x)

X

0.410

X2

X1

0.350

Y2

Y3

G1

X3

X2

0.795

R

X3

0.700

Y

0.825

Y1

0.500

Y2

0.480

Y3

0.500

X

R

R0.125

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	44 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

			U-DFN2018-6
A			A3
A			SEATING PLANE
			SEATING PLANE
	A1
Pin#1 ID			D
			D2
			L
	E		E2
	E
			z
		e	b
		e

U-DFN2018-6

Dim	Min	Max	Typ
A	0.545	0.605	0.575
A1	0	0.05	0.02
A3	-	-	0.13
b	0.15	0.25	0.20
D	1.750	1.875	1.80
D2	1.30	1.50	1.40
e	-	-	0.50
E	1.95	2.075	2.00
E2	0.90	1.10	1.00
L	0.20	0.30	0.25
z	-	-	0.30

All Dimensions in mm

Suggested Pad Layout

U-DFN2018-6

X

C

Y

Dimensions

Value

(in mm)

C

0.50

Y1

G

0.20

X

0.25

X1

1.60

G

Y

0.35

Y1

1.20

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	45 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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