Документ: Packages_Diodes_Inc, страницы 111-115 | База учебных материалов

Package Outline Dimensions

MSOP-8

D

x

y

1b

A2

e

A1

4
X
	1
	0
		°
0.25

E

GaugePlane

Seating Plane

L a 4X10°

DetailC

E3
A3
A
E1	c
	c
	SeDetailC

MSOP-8

Dim	Min	Max	Typ
A	-	1.10	-
A1	0.05	0.15	0.10
A2	0.75	0.95	0.86
A3	0.29	0.49	0.39
b	0.22	0.38	0.30
c	0.08	0.23	0.15
D	2.90	3.10	3.00
E	4.70	5.10	4.90
E1	2.90	3.10	3.00
E3	2.85	3.05	2.95
e	-	-	0.65
L	0.40	0.80	0.60
a	0°	8°	4°
x	-	-	0.750
y	-	-	0.750

All Dimensions in mm

Suggested Pad Layout

MSOP-8

X

C

Y

Dimensions

Value

(in mm)

C

0.650

X

0.450

Y1

Y

1.350

Y1

5.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	111 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

				MSOP-8EP
D
			D1			X
	E			0.25		4	1
	E			0.25			1
								0
									°
x
		E2
				GaugePlane
y				Seating Plane						a
y
				4
				X			L
					1		L
1					0°
1	8Xb
e	8Xb					DetailC
			E3			DetailC
A1	A3			c
	A3

A	A2
D			E1
				SeDetailC

MSOP-8EP

Dim	Min	Max	Typ
A	-	1.10	-
A1	0.05	0.15	0.10
A2	0.75	0.95	0.86
A3	0.29	0.49	0.39
b	0.22	0.38	0.30
c	0.08	0.23	0.15
D	2.90	3.10	3.00
D1	1.60	2.00	1.80
E	4.70	5.10	4.90
E1	2.90	3.10	3.00
E2	1.30	1.70	1.50
E3	2.85	3.05	2.95
e	-	-	0.65
L	0.40	0.80	0.60
a	0°	8°	4°
x	-	-	0.750
y	-	-	0.750

All Dimensions in mm

Suggested Pad Layout

X C

G

Y2

X1

MSOP8-EP

Y

Y1

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	0.650
	G	0.450
	X	0.450
	X1	2.000
	Y	1.350
	Y1	1.700
	Y2	5.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	112 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

MSOP-10

D

4	X10°

E			0.25
X	Gauge Plane
	Gauge Plane
Y	Seating Plane
	4X	10°	L	a
		10°
1
e

b (10X)

			E3
A2
A	D	A3	E1
A1			E1	c
A1				c

MSOP-10

Dim	Min	Max	Typ
a	0°	8°	4°
A	-	1.10	-
A1	0.05	0.15	0.10
A	0.75	0.95	0.86
b	0.17	0.27	0.20
c	0.08	0.23	0.15
D	2.95	3.05	3.00
e	-	-	0.50
E	4.80	5.00	4.90
E1	2.95	3.05	3.00
L	0.40	0.80	0.60

All Dimensions in mm

Suggested Pad Layout

MSOP-10

X

Dimensions

Value

(in mm)

C1

X

0.30

Y

1.4

C1

4.4

C2

0.50

Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	113 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		POWERDI®5
E1			A1
E1/2			A1
e
		°
		1
		±
		°
	b2D	0
	b2D	1
2Xb1		1
E/2		A		5
				5
			°
			±
E			1
	A2		°
	A2

		1
		0
		°
		±
	5	1
	5	°
	°	°
	°
	±
	1
	°

L1 E2

L1

W

D2

POWERDI®5

Dim	Min	Max	Typ
A	1.05	1.15	1.10
A2	0.33	0.43	0.381
b1	0.80	0.99	0.89
b2	1.70	1.88	1.78
D	3.90	4.05	3.966
D2	-	-	3.054
E	6.40	6.60	6.504
e	-	-	1.84
E1	5.30	5.45	5.37
E2	-	-	3.549
L	0.75	0.95	0.85
L1	0.50	0.65	0.57
W	1.10	1.41	1.255

All Dimensions in mm

L L

Suggested Pad Layout

POWERDI®5

X

Dimensions

Value (in mm)

C

1.840

G

0.852

Y

X

3.360

X1

1.390

Y

4.860

Y1

1.400

X1

G

(2x)

Y1

(2x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	114 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

						POWERDI®123

								POWERDI®123
C				E			Dim		Min	Max	Typ
C				E			Dim		Min	Max	Typ
							A		3.50	3.90	3.70

							B		2.60	3.00	2.80

		B
							C		1.63	1.93	1.78
							C		1.63	1.93	1.78
			H				D		0.93	1.00	0.98
D							E		0.85	1.25	1.00
							H		0.15	0.25	0.20
	L L1						L		0.40	0.50	0.45
							L		0.40	0.50	0.45
			L3				L1		1.25	1.40	1.35
			L3				L1		1.25	1.40	1.35
							L2		1.025	1.125	1.10
					L2		L3		0.125	0.275	0.20


							All Dimensions in mm
							All Dimensions in mm

		A
		A

Suggested Pad Layout

POWERDI®123


	X1	G	X2		Dimensions	POWERDI®123	POWERDI®323
	X1	G	X2		Dimensions	POWERDI®123	POWERDI®323
					G	1.0	0.5


					X1	2.2	2.0
					X1	2.2	2.0
					X2	0.9	0.8
Y2					X2	0.9	0.8
Y2				Y1	Y1	1.4	0.8
				Y1	Y1	1.4	0.8
					Y2	1.4	1.1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	115 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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