Документ: Packages_Diodes_Inc, страницы 106-110 | База учебных материалов

Package Outline Dimensions

			W-FLGA2520-17
		A3
		A1
		Seating Plane
A	E		e
	E		e	Pin#1ID
				Pin#1ID
Pin#1ID
				L
		D		La
				La
				b

W-FLGA2520-17

Dim Min Max

A	0.700	0.800
A1	0	0.050
A3	0.0203REF
b	0.200	0.300
D	2.420	2.580
E	1.950	2.050
e	0.500TYP
L	0.320	0.480
La	0.424	0.576

All Dimensions in mm

Suggested Pad Layout

Y19x

X8x

W-FLGA2520-17

X3

X2

Dimensions

Value

(in mm)

C

0.500

X

0.350

X1

0.600

X2

1.850

Y2Y3

X3

2.320

X19x

︶

Y

0.600

Y1

0.350

Y2

1.350

Y8x

Y3

2.800

︶

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	106 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

MiniDIP

	L			G				MiniDIP
	L



							Dim	Min	Max
							A	5.43	5.75

							B	3.6	4.0
		A B			D	E	C	0.15	0.35
							C	0.15	0.35
							D	0.05	0.20
							E	-	7.0
							E	-	7.0
							G	0.70	1.10


							H	4.5	4.9
							H	4.5	4.9
	H		C				J	2.3	2.7
	H		C				J	2.3	2.7
							K	2.3	2.7
							K	2.3	2.7
J							L	0.50	0.80
J							L	0.50	0.80
							All Dimensions in mm




	K
	K

Suggested Pad Layout

MiniDIP

X



			Dimensions	DF-S	MiniDIP
			Z	10.26	6.91
			Z	10.26	6.91

		Z	X	1.2	0.60


			Y	1.52	0.76


			C	5.2	2.67

Y
Y

	C
	C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	107 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

MiniMELF

A

MiniMELF

Dim

Min

Max

A

3.30

3.70

B

1.30

1.60

C

0.28

0.50

C

All

Dimensions

in mm

Suggested Pad Layout

MiniMELF

X

X1

Dimensions

Value (in mm)

MiniMELF

C

3.50

Y

G

2.10

X

1.30

X1

4.70

G

Y

1.70

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	108 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

MELF

A

MELF

Dim

Min

Max

A

4.80

5.20

B

2.40

2.60

C

0.55

Typ

C

All

Dimensions in mm

Suggested Pad Layout

MELF

X

X1

Dimensions

Value (in mm)

MELF

C

4.80

Y

G

3.30

X

1.50

X1

6.30

G

Y

2.70

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	109 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	D
	x
	y
E	Pin#1
E1	Pin#1

e

b

L

MSB

Seating Plane

	A4
10°	A1
10°	°
	7

E3

A5

cA

MSB

Dim	Min	Max	Typ
A	1.10	1.20	1.30
A1	0.00	0.02	0.05
A4	0.05	-	0.08
A5	0.03	0.05	0.08
b	0.55	0.60	0.70
c	0.12	0.15	0.18
D	4.40	4.50	4.60
E	4.90	5.00	5.10
E1	5.60	5.70	5.80
E3	2.95	3.00	3.05
e	3.45	3.50	3.55
L	0.65	0.70	0.75
x	0.60	0.65	0.70
y	0.60	0.65	0.70

All Dimensions in mm

Suggested Pad Layout

MSB

C

Dimensions

Value

(in mm)

C

3.55

Y1

X

0.90

Y

1.05

Y1

6.10

Y

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	110 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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