Документ: Packages_Diodes_Inc, страницы 121-125 | База учебных материалов

Package Outline Dimensions

			POWERDI®5060-8 (Type B)
			︶
D		b8X
D1				e/2
					K
		L			︶
					b24X
			D2
	E1E	E2
1.40	E1E
1.40		K1
1.90		K1			M
			E3		M1
					M1
Ø1.0Depth07±..03		G	e		L1
Ø1.0Depth07±..03
					θ (4 )
					X
	A	c			A1
	A				A1
	DETAIL A

θ1 X(4 )

POWERDI®5060-8

TYPE B

Dim	Min	Max	Typ
A	0.90	1.10	1.00
A1	0.00	0.05	––
b	0.33	0.51	0.41
b2	0.20	0.40	0.273
c	0.230	0.330	0.273
D		5.15 BSC
D1	4.70	5.10	4.90
D2	3.50	4.40	3.90
E		6.15 BSC
E1	5.60	6.00	5.80
E2	2.25	2.65	2.45
E3	0.595	0.995	0.795
e		1.27 BSC
G	0.51	0.71	0.61
K	0.51	––	––
K1	0.51	––	––
L	0.51	0.71	0.61
L1	0.05	0.20	0.175
M	3.235	4.035	3.635
M1	1.00	1.40	1.21
θ1	10°	12°	11°
θ2	6°	8°	7°

All Dimensions in mm

Suggested Pad Layout

POWERDI®5060-8 (Type B)

X1

Y1

Dimensions

Value (in mm)

Y3

C

1.270

Y2

X

0.610

X1

4.420

Y

0.910

Y6

Y1

0.910

Y2

0.895

Y4

Y5

Y3

2.130

Y4

0.585

Y5

2.550

Y6

6.550

︶

Y5x

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	121 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

							PowerDI5060-8 (Type C)
		D
		D1					︶
							︶
							04x
		x				c	A1
					E1E		A1
y							Seating Plane
							Seating Plane
							e
	1						︶
		Ø1.0Depth07±..03					014x
		Ø1.0Depth07±..03
							DETAIL A
		︶
		b18x		e/2
b8x				e/2
		1				︶
		D3				︶
					b22x
L					k
L
		k1					A
E2		D2	L4
E2		D2			M		DETAIL A
			D2		M		DETAIL A
			D2
La					L1

PowerDI5060-8 (Type C)

Dim	Min		Max	Typ
A	0.90		1.10	1.00
A1	0		0.05	0.02
b	0.33		0.51	0.41
b1	0.300		0.366	0.333
b2	0.20		0.35	0.25
c	0.23		0.33	0.277
D		5.15 BSC
D1	4.85		4.95	4.90
D2	1.40		1.60	1.50
D3	-		-	3.98
E		6.15 BSC
E1	5.75		5.85	5.80
E2	3.56		3.76	3.66
e			1.27BSC
k	-		-	1.27
k1	0.56		-	-
L	0.51		0.71	0.61
La	0.51		0.71	0.61
L1	0.05		0.20	0.175
L4	-		-	0.125
M	3.50		3.71	3.605
x	-		-	1.400
y	-		-	1.900
θ	10°		12°	11°
θ1	6°		8°	7°

All Dimensions in mm

Suggested Pad Layout

PowerDI5060-8 (Type C)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	122 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

X4

8

Dimensions

Value

(in mm)

C

1.270

X3

Y1

G

0.660

X2

G1

0.820

Y2

X

0.610

X1

3.910

Y3

G1

X2

1.650

X3

1.650

X1

X4

4.420

Y

1.270

Y4x

Y1

1.020

︶

Y2

3.810

Y3

6.610

1

X

C

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	123 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

POWERDI®5SP

	E	E/2
		E/2
	b 2x	J 4x	K 4x
		J 4x
	M 4x	R
		R
D	N 8x	3
D	N 8x
	E1
	TOP VIEW
	?	Cutting Burr Side
	A

8x cut faces are not tin plated

		H1

E2	' ?1
	' ?1	L 2x
		L 2x

R

D2

W L1

BOTTOM VIEW

		POWERDI®5SP
R1	Dim	Min	Max	Typ
R1	A	−	0.75	−
	A	−	0.75	−
c	b	4.30	4.50	4.40
c	c	0.155	0.195	−
	D	5.70	5.90	5.80
	D2	4.40	−	−
R2	E	23.6	24.0	23.8
R2	E1	5.70	5.90	5.80
	E1	5.70	5.90	5.80
	E2	2.74	−	−
	H1	0.19	0.21	0.20
	J	−	−	0.20
	K	−	−	0.30
	L	−	−	9.00
	L1	−	−	2.50
	M	−	−	0.30
	N	0	0.20	−
	R	−	−	0.40
	R1	−	−	0.15
	R2	−	−	0.25
	R3	−	−	0.40
	W	1.66	2.06	−
	θ	8º	12º	−
	θ1	3º	7º	−
	All	Dimensions in mm

Suggested Pad Layout

X

G

Dimensions

Value

(in mm)

G

8.101

Y

X

8.100

Y

5.100

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	124 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

POWERDI®5SP (Type B)

			E	E/2
			E1/2	E/2	K 4x
				J 4x	K 4x
				J 4x
		N 8x	M 4x	R
D	b 2x	N 8x		3
D	b 2x
					2
			E1		R
			E1
		A	TOP VIEW	H1
			ø	Cutting Burr Side
	8x cut faces are not		ø1	V Groove Inner Line
	8x cut faces are not			V Groove Inner Line
		tin plated	E2
			E2	L 2x
				L 2x

R

D2

W

L1

BOTTOM VIEW

		POWERDI®5SP
R1		Type B
R1	Dim	Min	Max	Typ
	Dim	Min	Max	Typ
c	A	−	0.75	−
c	b	4.30	4.50	4.40
	b	4.30	4.50	4.40
	c	0.155	0.191	−
	D	5.70	5.90	5.80
	D2	4.40	−	−
	E	20.8	21.2	21.0
	E1	5.70	5.90	5.80
	E2	2.90	−	−
	H1	0.19	0.21	0.20
	J	−	−	0.20
	K	−	−	0.30
	L	−	−	7.60
	L1	−	−	2.50
	M	−	−	0.30
	N	0	0.20	−
	R	−	−	0.40
	R1	−	−	0.15
	R2	−	−	0.25
	R3	−	−	0.40
	W	1.63	1.97	1.80
	Ø	8º	12º	−
	Ø1	3º	7º	−
	All	Dimensions in mm

Suggested Pad Layout

X

G

Dimensions

Value

(in mm)

G

8.101

Y

X

8.100

Y

5.100

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	125 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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