Документ: Packages_Diodes_Inc, страницы 101-105 | База учебных материалов

Package Outline Dimensions

U-DFN6040-12

		A1
	A
		D
		e
	D1	D2
	D1	E2
E	E1	E2
E	E1
	Z	b

	A3
			U-DFN6040-12

Seating Plane		Dim	Min	Max	Typ
Seating Plane		A	0.55	0.65	0.60
		A	0.55	0.65	0.60
		A1	0	0.05	0.02
		A1	0	0.05	0.02
		A3	-	-	0.15
		b	0.35	0.45	0.40
		D	5.95	6.05	6.00
		D1	1.95	2.15	2.05
		D2	2.35	2.55	2.45
		e	-	-	1.00
		E	3.95	4.05	4.00
	L	E1	2.10	2.30	2.20
		E2	1.80	2.00	1.90
		E2	1.80	2.00	1.90
		L	0.35	0.45	0.40
		L	0.35	0.45	0.40
		Z	-	-	0.30
		All	Dimensions in mm

Suggested Pad Layout

U-DFN6040-12

	X3
	C
Y1
X1	X2
Pin1	X
	X

	Y				Dimensions	Value
			G			(in mm)
						(in mm)
					C	0.500
					C	0.500
					G	0.650
					G1	0.350
					G1	0.350
					X	0.250
					X	0.250
					X1	1.075
					X1	1.075
				Y3	X2	1.275
		Y2

G1					X3	2.750
					Y	0.400
					Y1	1.150
					Y2	1.000
					Y2	1.000
					Y3	2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	101 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

V-DFN6040-22

	A1
	A3
A	Seating Plane
	Seating Plane
	D
	e
	L
	D2
E	E2
	D2a
	PIN#1ID.
	C0.3
Z	b

V-DFN6040-22

Dim	Min		Max	Typ
A	0.75		0.85	0.80
A1	0.00		0.05	0.02
A3		0.203 BSC
b	0.20		0.30	0.25
D	5.95		6.05	6.00
D2	3.82		4.02	3.92
D2a	1.10		1.30	1.20
E	3.95		4.05	4.00
E2	2.44		2.64	2.54
e		0.50 BSC
L	0.35		0.45	0.40
Z	-		-	0.375

All Dimensions in mm

Suggested Pad Layout

V-DFN6040-22

X3

X1 X2

G1

G

Y1

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	0.500
	G	0.280
	G1	0.200
	X	0.350
	X1	1.330
Y2	X1	1.330
Y2	X2	4.050
	X2	4.050
	X3	5.660
	Y	0.650
	Y	0.650
	Y1	0.270
	Y1	0.270
	Y2	4.400
	Y2	4.400

Y

X C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	102 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	D-FLAT
H	L k
E
E
	b

D

A

c

D-FLAT

Dim	Min	Max
A	0.90	1.10
b	1.25	1.65
c	0.10	0.40
D	2.25	2.95
E	3.95	4.60
k	2.80	-
HE	5.00	5.60
L	0.50	1.30

All Dimensions in mm

Suggested Pad Layout

D-FLAT

X

X1

Dimensions

Value

(in mm)

Y

C

4.65

G

2.80

X

1.85

X1

6.50

Y

1.70

G

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	103 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

									DF-S
		L				G



											DF-S
										Dim	Min	Max
										A	7.40	7.90
										B	6.20	6.50
				A B			D	E		C	0.22	0.30
										C	0.22	0.30
										D	0.076	0.33
										E	-	10.40
										E	-	10.40
										G	1.02	1.53
										G	1.02	1.53

										H	8.13	8.51

		H			C
										J	2.40	2.60
										J	2.40	2.60

										K	5.00	5.20


	J									L	1.00	1.20
	J									L	1.00	1.20
										All Dimensions in mm



		K
		K

Suggested Pad Layout
									DF-S
			X

Dimensions

DF-S

Z

10.26

Z

X

1.2

Y

1.52

C

5.2

Y

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	104 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-FLGA1515-9

A1	A3
A

Seating Plane

	D
	e
	1
	.
	0
E	R
E

	Pin#1ID	e
		Z
	bSQ.

U-FLGA1515-9

Dim	Min		Max	Typ
A	0.55		0.65	0.60
A1	0		0.05	0.02
A3			0.13 BSC
b	0.20		0.30	0.25
D	1.45		1.55	1.50
E	1.45		1.55	1.50
e			0.50 BSC
Z		0.125 BSC

All Dimensions in mm

Suggested Pad Layout

U-FLGA1515-9

X1

X

G

Y

Dimensions

Value

(in mm)

C

0.587

G

0.150

G1

0.150

Y2Y1

X

0.525

G1

X1

0.350

X2

1.700

Y

0.525

Y1

0.350

C

Y2

1.700

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	105 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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