Документ: Packages_Diodes_Inc, страницы 136-140 | База учебных материалов

Package Outline Dimensions

B

A

C

D

J
H	G
	E

SMC

Dim	Min	Max
A	5.59	6.22
B	6.60	7.11
C	2.75	3.18
D	0.15	0.31
E	7.75	8.13
G	0.10	0.20
H	0.76	1.52
J	2.00	2.50

All Dimensions in mm

Suggested Pad Layout

SMC

X1

X

Dimensions

Value

(in mm)

C

6.90

Y

G

4.40

X

2.50

X1

9.40

G

Y

3.30

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	136 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SO-8

E1 E	0.254
A1	L
	L
	Detail ‘A’
h	7°~9°
	45°

	A2	A	A3
e	b
	D

			SO-8
		Dim	Min	Max
		A	-	1.75
		A1	0.10	0.20
Gauge Plane		A2	1.30	1.50
Seating Plane		A3	0.15	0.25
		b	0.3	0.5
		D	4.85	4.95
		E	5.90	6.10
		E1	3.85	3.95
		e	1.27	Typ
	Detail ‘A’	h	-	0.35
		L	0.62	0.82
		θ	0°	8°
		θ	0°	8°
		All	Dimensions	in mm

Suggested Pad Layout

SO-8

X

Dimensions

Value (in mm)

X

0.60

C1

Y

1.55

C1

5.4

C2

1.27

Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	137 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SO-8EP

EXPOSE DPAD	F

E1

H

1

b

9°
A
ls
ide

.1	e	A1	A
0
R
	D

		5	Q C
		E
		N
	7°	4
4		°
4
°
±
3
°
			L
		E0

Gauge Plane

Seating Plane

SO-8EP

Dim	Min	Max	Typ
A	1.40	1.50	1.45
A1	0.00	0.13	-
b	0.30	0.50	0.40
C	0.15	0.25	0.20
D	4.85	4.95	4.90
E	3.80	3.90	3.85
E0	3.85	3.95	3.90
E1	5.90	6.10	6.00
e	-	-	1.27
F	2.75	3.35	3.05
H	2.11	2.71	2.41
L	0.62	0.82	0.72
N	-	-	0.35
Q	0.60	0.70	0.65

All Dimensions in mm

Suggested Pad Layout

SO-8EP

X2

Y2	Y1
Y2
	X1




	Dimensions	Value
	Dimensions	(in mm)
	C	1.270
	X	0.802
	X1	3.502
	X2	4.612
	Y	1.505
	Y1	2.613
Y	Y2	6.500

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	138 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SO-8EP

Detail ‘A’ 7°~ 9°

	E1	E
		45°
		h
		A3
	A2	A		0.254
e	b			0.254	Gauge Plane
e	b	A1			Gauge Plane
	D	A1	L		Seating Plane
		Detail ‘A’	L

Exposed Pad

F

P1	P2
P3
G		C2
C1	C1	F2
		F2

Bottom View

SO-8EP

Dim		Min	Max	Dim	Min	Max
A		-	1.75	e	1.27	Typ
A1	0.10		0.20	F1	0.685 Typ
A2	1.30		1.50	F2	0.713 Typ
A3	0.15		0.25	G	0.20 Typ
b	0.3		0.5	h	-	0.35
C1	1.7		Typ	L	0.62	0.82
C2		0.9 Typ		P1	2.05	Typ
D	4.85		4.95	P2	1.15 Typ
E	5.90		6.10	P3	2.15 Typ
E1	3.85		3.95	θ	0°	8°
		All Dimensions in mm

Suggested Pad Layout

SO-8EP

X2

Y2	Y1
Y2
	X1




	Dimensions	Value
	Dimensions	(in mm)
	C	1.270
	X	0.802
	X1	3.502
	X2	4.612
	Y	1.505
	Y1	2.613
Y	Y2	6.500

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	139 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

E H



			D	A2	A
7			D


°
	(
	4
	x
		)

B

e

A1

SO-14

Dim

Min

Max

Gauge Plane

A

1.47

1.73

A1

0.10

0.25

L

θ

A2

1.45

Typ

Detail “A”

B

0.33

0.51

D

8.53

8.74

E

3.80

3.99

e

1.27

Typ

H

5.80

6.20

L

0.38

1.27

θ

0°

8°

Detail “A”

All

Dimensions

in mm

Suggested Pad Layout

SO-14

X

Dimensions

Value (in mm)

X

0.60

Y

1.50

C1

5.4

C2

1.27

Y

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	140 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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