Документ: Packages_Diodes_Inc, страницы 131-135 | База учебных материалов

Package Outline Dimensions

				QSOP-20
	D
ZD
E1/2			E/2
E1/2
E1			E		SEDETAIL 'A
E1			E
			h
PIN1	e		h
	e			c
		b		c
		b				︶
					θ	︶
					14x
					θ
					2
A2						R1
A2						R
A						θ
						θ
						GAUGE PLANE
				︶		SEATIN GPLANE
A1			θ	︶	L	L2
			14x
						L1

QSOP-20

Dim	Min	Max	Typ
A	1.55	1.73	-
A1	0.10	0.25	-
A2	1.40	1.50	-
b	0.20	0.30	-
c	0.18	0.25	-
D	8.56	8.74	-
E	5.79	6.20	-
E1	3.81	3.99	-
e	0.635 BSC
h	0.254	0.508	-
L	0.41	1.27	-
L1	1.03 REF
L2	0.254 BSC
R	0.0762	-	-
R1	0.0762	-	-
ZD	1.47 REF
θ	0°	8°	-
θ1	5°	15°	-
θ2	0°	-	-

All Dimensions in mm

Suggested Pad Layout

QSOP-20

X1

Y

Dimensions

Value

(in mm)

C

0.635

Y1

X

0.350

X1

6.065

C

Y

1.450

Y1

6.400

1

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	131 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SM-8

		E				A
		E1				A			SM-8
							A1		SM-8
							A1
								Dim	Min	Max	Typ
	b							A	-	1.7	-
								A1	0.02	0.1	-
D				e	e1			b	-	0.7	-
								b	-		-
								c	0.24	0.32	-
								c	0.24	0.32	-
								D	6.3	6.7	-
								e	-	-	1.53
								e	-	-	1.53
15°			Pin #1					e1	-	-	4.59
								E	6.7		-
		45°						E	6.7	7.3	-
								E1	3.3	3.7	-
								L	0.9	-	-
								L	0.9	-	-
				c				All	Dimensions in mm
				c				All	Dimensions in mm

L

Suggested Pad Layout

SM-8

Y (8x)

C1

Y1

Dimensions

Value (in mm)

C

1.52

C1

4.6

X

0.95

Y

2.80

Y1

6.80

X (8x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	132 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

B

A

C

D

J
H	G
	E

SMA

Dim	Min	Max
A	2.29	2.92
B	4.00	4.60
C	1.27	1.63
D	0.15	0.31
E	4.80	5.59
G	0.05	0.20
H	0.76	1.52
J	2.01	2.30

All Dimensions in mm

Suggested Pad Layout

SMA

X

X1

Dimensions

Value (in mm)

4.00

C

Y

G

1.50

X

2.50

G

X1

6.50

C

Y

1.70

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	133 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SMAF

H

L

E

b

SMAF

Dim

Min

Max

A

0.90

1.10

D

b

1.25

1.65

c

0.10

0.40

D

2.25

2.95

E

3.95

4.60

A

c

HE

4.80

5.60

L

0.50

1.50

All

Dimensions

in mm

Suggested Pad Layout

SMAF

X

X1

Dimensions

Value (in mm)

4.00

C

Y

G

1.50

X

2.50

G

X1

6.50

C

Y

1.70

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	134 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

B

A

C

D

J
H	G
	E

SMB

Dim	Min	Max
A	3.30	3.94
B	4.06	4.57
C	1.96	2.21
D	0.15	0.31
E	5.00	5.59
G	0.05	0.20
H	0.76	1.52
J	2.00	2.50

All Dimensions in mm

Suggested Pad Layout

SMB

X

X1

Dimensions

Value (in mm)

4.30

C

Y

G

1.80

X

2.50

G

X1

6.80

C

Y

2.30

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	135 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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