Документ: Packages_Diodes_Inc, страницы 141-145 | База учебных материалов

Package Outline Dimensions
			SO-16
					SO-16
				Dim	Min	Max
	E	H	Gauge Plane	A	1.40	1.75
			Gauge Plane	A1	0.1	0.25
			θ	A2	1.30	1.50
			L	B	0.33	0.51
			Detail ‘A’	C	0.19	0.25
				D	9.80	10.00
				E	3.80	4.00
	D	A		e	1.27 Typ
	A2			H	5.80	6.20
				L	0.38	1.27
				θ	0°	8°
B	e	A1	C	All Dimensions in mm
B	e	A1	C
			Detail ‘A’

Suggested Pad Layout

SO-16

X1

Dimensions

Value

(in mm)

C

1.270

Y1

X

0.670

X1

9.560

Y

1.450

Y

Y1

6.400

Pin1

C

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	141 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions
				SO-20
	D			Ø	Dim	Min	SO-20	Typ
				R	Dim	Min	Max	Typ
				R1	A	2.35	2.65	2.52
				R1	A1	0.10	0.30	0.20
					A1	0.10	0.30	0.20
				L1	A2	2.05	2.55	2.35
			Ø1	Ø2	A3	0.90	1.10	1.00
				Ø2	b	0.35	0.49	-
					b	0.35	0.49	-
	Index	E1 E			c	0.23	0.32	-
	Index				D	12.60	12.80	12.70
					D	12.60	12.80	12.70
					E	10.00	10.60	10.20
					E1	7.40	7.60	7.50
					e		1.27 BSC
				L	L	0.50	1.27	0.80
		A1			L1		1.35 REF
A3	Ø3	A1		c	R/R1	0.07	-	-
					θ	0°	8°	-
		A2 A			θ1	10°	14°	12°
		A2 A			θ2	6°	10°	8°
			Seating Plane		θ2	6°	10°	8°
Ø4	e		Seating Plane		θ3	9°	14°	11.5°
	e				θ4	6°	10°	8°


	b					All Dimensions in mm

Suggested Pad Layout

SO-20

Y

Dimensions

Value

(in mm)

C

1.27

Y1G

G

8.00

X

0.60

Y

1.50

Y1

11.00

X

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	142 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOD123

	C
	H
B	A

K

M

L

SOD123

Dim	Min	Max
A	0.55	Typ
B	1.40	1.70
C	3.55	3.85
H	2.55	2.85
J	0.00	0.10
K	1.00	1.35
L	0.25	0.40
M	0.10	0.15
α	0	8°

All Dimensions in mm

Suggested Pad Layout

SOD123

X1

X

Y

Dimensions

Value (in mm)

G

2.250

X

0.900

X1

4.050

Y

0.950

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	143 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOD123F

E	L2

						SOD123F




b				D	Dim	Min	Max	Typ
					A	0.81	1.15	-
					A	0.81	1.15	-
					b	0.80	1.35	-

					c	0.05	0.30	-
					D	1.70	1.90	1.80
		He			D	1.70	1.90	1.80
		He			E	2.60	2.80	2.70
					He	3.30	3.70	3.50
					L2	0.35	0.85	-
					All	Dimensions in mm
	c		A
	c		A

Suggested Pad Layout

SOD123F

C

Dimensions

Value (in mm)

C

2.86

Y

G

1.52

X

1.34

X1

4.20

X

G

Y

1.80

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	144 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOD323

		C
		H
					SOD323
				Dim	Min	Max
		A		A	0.25	0.35
B		A		B	1.20	1.40
				C	2.30	2.70
				H	1.60	1.80
				J	.00	0.10
				K	1.0	1.1
				L	0.20	0.40
				M	0.10	0.15
	M	K	J	α	0°	8°
	M		J	All Dimensions in mm
		L		All Dimensions in mm
		L

Suggested Pad Layout

SOD323

X1

Y

X

Dimensions

Value (in mm)

G

1.520

X

0.590

X1

2.700

Y

0.450

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	145 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

Смотрите также: