Документ: Packages_Diodes_Inc, страницы 146-150 | База учебных материалов

Package Outline Dimensions

SOD323F

		c
D		c
D

									SOD323F
							L2 (2x)

					α2			Dim	Min	Max	Typ
				α1	α2
								A	0.60	0.75	-
								b	0.25	0.35	-

He	E							c	0.05	0.26	-
He	E							c	0.05	0.26	-
								D	1.15	1.35	1.25
								E	1.60	1.80	1.70
								E	1.60	1.80	1.70
								He	2.30	2.70	2.50
								He	2.30	2.70	2.50
					L1			L1	0.30	0.50	0.40
								L2	0.41	0.61	0.51
		b (2x) β1				b (2x)		α1	-	-	7°
		b (2x) β1				b (2x)		α2	-	-	3°

								β1	-	-	7°
								β1	-	-	7°
	A							β2	-	-	3°
				2				All	Dimensions in mm
			β

Suggested Pad Layout

SOD323F

X1

X

Y

Dimensions

Value (in mm)

G

1.280

X

0.710

X1

2.700

G

Y

0.403

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	146 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOD523

L

SOD523

Dim

Min

Max

A

0.25

0.35

C

H

B

0.70

0.90

C

1.50

1.70

H

1.10

1.30

K

0.55

0.65

L

0.10

0.30

M

0.10

0.12

M

All Dimensions in mm

A

B

K

Suggested Pad Layout

SOD523

X1

X

Y

Dimensions

Value (in mm)

G

0.80

X

0.60

X1

2.00

Y

0.70

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	147 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

E

D

b2x

SOD923 (0.2mm Lead Width)

L2

		He
A		a	A
		1
		a2
	c	L
		L

SOD923

(0.2mm Lead Width)

Dim	Min	Max	Typ
A	0.34	0.40	0.37
b	0.15	0.25	0.20
c	0.070	0.170	0.120
D	0.55	0.65	0.60
E	0.75	0.85	0.80
He	0.95	1.05	1.00
L	0.05	0.15	0.10
L2	0.190 REF
a1	0°	8°	7°
a2	2°	4°	3°

All Dimensions in mm

Suggested Pad Layout

SOD923 (0.2mm Lead Width)

X

Dimensions

Value

Y

(in mm)

C

0.900

X

0.300

Y

0.400

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	148 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOD923 (0.3mm Lead Width)

E	︶	L2
	b2x

D

	He
A	a	A
	1
	a2

SOD923

(0.3mm Lead Width)

Dim	Min	Max	Typ
A	0.34	0.40	0.37
b	0.25	0.35	0.30
c	0.05	0.15	0.10
D	0.55	0.65	0.60
E	0.75	0.85	0.80
He	0.95	1.05	1.00
L	0.05	0.15	0.10
L2	0.190 REF
a1	0°	8°	7°
a2	2°	4°	3°

All Dimensions in mm

Suggested Pad Layout

SOD923 (0.3mm Lead Width)

XX

Dimensions

Value

(in mm)

Y

C

0.900

X

0.400

Y

0.600

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	149 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT143

A1

G F

CB

D

A2

H

K

J

	M	0.25
	M	GAUGE PLANE
		GAUGE PLANE
		SEATIN GPLANE
		a
		L

SOT143

Dim	Min	Max	Typ
A1	0.37	0.51	0.400
A2	0.77	0.93	0.800
B	1.20	1.40	1.30
C	2.28	2.48	2.38
D	1.58	1.83	1.72
F			0.49
F	0.45	0.60	0.49
G	1.78	2.03	1.92
H	2.80	3.00	2.90
J	0.013	0.10	0.05
K	0.89	1.00	-
L	0.46	0.60	0.50
M	0.085	0.18	0.11
a			-
a	0°	8°	-

All Dimensions in mm

Suggested Pad Layout

SOT143

X

X2

Dimensions

Value (in mm)

Z

2.70

Y

G

1.30

X

2.50

Z

G

C

X1

1.0

X2

0.60

Y

0.70

C

2.0

X1

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	150 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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