Документ: Packages_Diodes_Inc, страницы 191-195 | База учебных материалов

Package Outline Dimensions

X3-WLB0603-3

D							b
D							b

L

X3-WLB0603-3

(3x)

Dim

Min

Max

Typ

E

e

A

0.24

0.30

−

A1

0.00

0.01

−

e1

b

0.23

0.29

0.26

b1

0.075

0.135

0.105

D

−

0.30

E

−

0.60

b1

e

−

0.40

e1

−

0.155

A

L

0.13

0.19

0.16

All Dimensions in mm

A1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	191 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	U-WLB0808-4
D	e
	e
PIN#1ID
	Ee
	︶
	ØbX4

A2

A

A3 SEATIN GPLANE

U-WLB0808-4

Dim	Min	Max	Typ
A		0.511 REF
A2	0.336	0.366	0.351
A3	0.15	0.17	0.16
b	0.205	0.225	0.215
D	0.795	0.825	0.81
E	0.795	0.825	0.81
e	—	—	0.40

All Dimensions in mm

Suggested Pad Layout

U-WLB0808-4

ØD4X

C	Dimensions	Value
		Value
		(in mm)
	C	0.40
	D	0.172
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	192 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions
			X1-WLB0808-4
				︶
	E		e	Øb4x
			e
Pin1
						X1-WLB0808-4
		D			Dim	Min	Max	Typ
		D		e	A	0.3320	0.4180	0.3750
					A	0.3320	0.4180	0.3750
					A1	0.1350	0.1650	0.1500
					A1	0.1350	0.1650	0.1500
					A2	0.1750	0.2250	0.2000
					A3	0.0220	0.0280	0.0250
			Backsid eCoating		b	0.1971	0.2409	0.2190
			Backsid eCoating		D	0.7900	0.8100	0.8000
		A3			D	0.7900	0.8100	0.8000
					E	0.7900	0.8100	0.8000
					e	0.400 BSC
		A2	A		All Dimensions in mm
		A2

Seating Plane		A1
Seating Plane

Suggested Pad Layout

︶	X1-WLB0808-4
︶
ØD4x
ØD4x

C

Dimensions	Value
Dimensions	(in mm)
C	0.4000
D	0.2190

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	193 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-WLB1006-2

A1

A

Seating Plane

D

e

Z2

︶

E

b2x

L1

L2

Z1

Suggested Pad Layout

X2-WLB1006-2

Dim	Min	Max	Typ
A	0.27	0.35	0.30
A1	00	0.03	0.02
b	0.459	0.559	0.509
D	0.95	1.05	1.000
E	0.55	0.65	0.600
e	-	-	0.578
L1	0.194	0.294	0.244
L2	0.369	0.469	0.419
Z1	0.016	0.076	0.046
Z2	0.016	0.076	0.046

All Dimensions in mm

X2-WLB1006-2

X2

Dimensions

Value

(in mm)

X

0.332

Y

X1

0.507

X2

0.989

Y

0.579

X

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	194 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X3-WLB1006-2

A	A1
A
	Seating Plane
	D
R
	︶
E	b2x

L3 kL3a

Suggested Pad Layout

X3-WLB1006-2

X2

Y

X X1

X3-WLB1006-2

Dim	Min	Max	Typ
A	0.25	0.30	0.275
A1	0.00	0.01	-
b	0.450	0.550	0.500
D	0.95	1.05	1.000
E	0.55	0.65	0.600
k	-	-	0.288
L3	0.194	0.294	0.244
L3a	0.350	0.450	0.400
R	-	-	0.100

All Dimensions in mm

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	X	0.332
	X1	0.507
	X2	0.989
	Y	0.579

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	195 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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