Документ: Packages_Diodes_Inc, страницы 186-190 | База учебных материалов

Package Outline Dimensions

			TSOT26F
	D
E1		E
			SEVIEWC
b	e	c
b		c
	e1		︶
	e1	VIEWC	04x
		VIEWC	04x

A	︶
	04x

TSOT26F

Dim	Min	Max	Typ
A	0.700	0.775	0.750
b	0.350	0.500	-
c	0.100	0.200	-
D	2.800	3.100	2.900
E	3.700	3.900	3.800
E1	1.500	1.700	1.600
e	-	-	0.950
e1	-	-	1.900
θ	4°	12°	10°

All Dimensions in mm

Suggested Pad Layout

TSOT26F

C

X

Y

Dimensions

Value

(in mm)

C

0.950

Y1

X

0.700

X1

2.600

Y

1.000

Y1

4.220

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	186 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

D

L

b

K

X2-WLB0505-3






					A1	A		X2-WLB0505-3

	E						Dim	Min	Max	Typ
							A	0.35	0.40	−
							A	0.35	0.40	−
		L1					A1	0.00	0.01	−
							A1	0.00	0.01	−

				SEATING PLANE			b	0.12	0.18	0.15
							D	−	−	0.50
							D	−	−	0.50
							E	−	−	0.50


							K	−	−	0.16
K							L	0.43	0.49	0.46
							L1	0.07	0.13	0.10


							L2	0.17	0.23	0.20
			L2				L2	0.17	0.23	0.20
			L2				All Dimensions in mm
							All Dimensions in mm

Suggested Pad Layout

X2-WLB0505-3

X1	Y

Dimensions

Value

(in mm)

X

0.17

X1

0.50

Y2

Y

0.22

Y1

0.12

Y1

Y2

0.50

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	187 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-WLB0603-2

D






	E
	E

			e					X2-WLB0603-2
								X2-WLB0603-2
							Dim	Min	Max	Typ
						L	A	0.26	0.34	0.30
							A1	0	0.02	0.01

							b	0.20	0.28	0.24
Pin#1ID					b		D	0.28	0.32	0.30
Pin#1ID							E	0.58	0.62	0.60
							E	0.58	0.62	0.60
							e	0.42	0.34	0.38
							e	0.42	0.34	0.38
							L	0.11	0.15	0.13
							All	Dimensions in mm
			A				All	Dimensions in mm
			A
		A1
		A1		Seating Plane

Suggested Pad Layout

X2-WLB0603-2

Dimensions

Value

Y1

(in mm)

X

0.300

Y

0.210

Y1

0.610

Y

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	188 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X3-WLB0603-2

D

E e

L2X

	︶
Pin#1ID	b2X
Pin#1ID

A

A1

Seating Plane

X3-WLB0603-2

Dim	Min	Max	Typ
A	0.26	0.34	0.30
A1	0.00	0.01	—
b	0.22	0.28	0.25
D	—	—	0.30
E	—	—	0.60
e	—	—	0.40
L	0.12	0.18	0.15

All Dimensions in mm

Suggested Pad Layout

X3-WLB0603-2

Y

Y1

Dimensions

Value (in mm)

X

0.30

Y

0.21

Y1

0.60

Y

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	189 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X4-WLB0603-2

A1

A

Seating Plane

	D
	e
E	b2x
	b2x
	︶
	L32x
	︶

X4-WLB0603-2

Dim	Min	Max	Typ
A	--	--	0.20
A1	0.006	0.01	0.008
b	0.19	0.29	0.24
D	0.595	0.645	0.62
E	0.295	0.345	0.320
e	-	-	0.355
L3	0.14	0.24	0.19

All Dimensions in mm

Suggested Pad Layout

X4-WLB0603-2

X1

Dimensions

Value

(in mm)

Y

X

0.230

X1

0.610

Y

0.300

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	190 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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