Документ: Packages_Diodes_Inc, страницы 181-185 | База учебных материалов

Package Outline Dimensions

TSSOP-20

D

E1 E

θ2

PIN 1

ID MARK

			0.25
	e		Gauge Plane
	e
					θ3
	A2	A	θ1	L	Seating Plane
					Seating Plane
					DETAIL
b	A1				L1
	A1

TSSOP-20

Dim	Min		Max	Typ
A	-	1.20		-
A1	0.05	0.15		-
A2	0.80	1.05		-
b	0.19	0.30		-
c	0.09	0.20		-
D	6.40	6.60		6.50
E	6.20	6.60		6.40
E1	4.30	4.50		4.40
e		0.65 BSC
L	0.45	0.75		0.60
L1		1.0 REF
θ1	0°		8°	-
θ2	10°		14°	12°
θ3	10°		14°	12°

All Dimensions in mm

Suggested Pad Layout

TSSOP-20

X C

Dimensions

Value

(in mm)

C

0.650

X

0.420

Y1

Y2

X1

6.270

Y

1.780

Y1

4.160

Y2

7.720

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	181 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

TSSOP-20EP

D

X

E1EY

PIN1

IDMARK

e

0.25 GaugePlane

2A A

θ1

L

Seating Plane

b 1A

DETAIL

L1

TSSOP-20EP

Dim	Min	Max	Typ
A	-	1.20	-
A1	0.025	0.100	-
A2	0.80	1.05	0.90
b	0.19	0.30	-
c	0.09	0.20	-
D	6.40	6.60	6.50
E	6.20	6.60	6.40
E1	4.30	4.50	4.40
L	0.45	0.75	0.60
L1		1.0 REF
L2		0.65 BSC
X	-	-	4.191
Y	-	-	2.997
θ1	0°	8°	-

All Dimensions in mm

Suggested Pad Layout

TSSOP-20EP

X (20x)

C

Dimensions

Value

(in mm)

C

0.650

X

0.420

Y1

Y2

Y3

X1

4.490

X1

X2

6.270

Y

1.780

Y1

3.290

Y (20x)

Y2

4.160

Y3

7.720

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	182 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

			TSOT25
	D
	e1
E1	E
		c	L2
		c
	L		θ
	L
e	4x θ1
	5x b

AA2

A1

TSOT25

Dim	Min	Max	Typ
A	-	1.00	-
A1	0.01	0.10	-
A2	0.84	0.90	-
D	-	-	2.90
E	-	-	2.80
E1	-	-	1.60
b	0.30	0.45	-
c	0.12	0.20	-
e	-	-	0.95
e1	-	-	1.90
L	0.30	0.50
L2	-	-	0.25
θ	0°	8°	4°
θ1	4°	12°	-

All Dimensions in mm

Suggested Pad Layout

TSOT25

C

Dimensions

Value

(in mm)

Y1

C

0.950

X

0.700

Y

1.000

Y (5x)

Y1

3.199

X (5x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	183 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

			TSOT25F
	D
E1		E
			SEVIEWC
b	e	c
b		c
	e1		︶
		VIEWC	04x
A		︶
A		04x

TSOT25F

Dim	Min	Max	Typ
A	0.700	0.775	0.750
b	0.350	0.500	-
c	0.100	0.200	-
D	2.800	3.100	2.900
E	3.700	3.900	3.800
E1	1.500	1.700	1.600
e	-	-	0.950
e1	-	-	1.900
θ	4°	12°	10°

All Dimensions in mm

Suggested Pad Layout

TSOT25F

C1

Dimensions

Value

(in mm)

X

C

0.950

C1

1.900

Y1

X

0.700

C

X1

2.600

Y

1.000

Y1

4.220

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	184 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	TSOT26
	D
	e1
E1	E
	c	L2
	c
	L	θ
	L
e	4x θ1
	6x b

AA2

A1

TSOT26

Dim	Min	Max	Typ
A	-	1.00	-
A1	0.01	0.10	-
A2	0.84	0.90	-
D	-	-	2.90
E	-	-	2.80
E1	-	-	1.60
b	0.30	0.45	-
c	0.12	0.20	-
e	-	-	0.95
e1	-	-	1.90
L	0.30	0.50	-
L2	-	-	.25
θ	0°	8°	4°
θ1	4°	12°	-

All Dimensions in mm

Suggested Pad Layout

TSOT26

C

Dimensions

Value

(in mm)

Y1

C

0.950

X

0.700

Y

1.000

Y (6x)

Y1

3.199

X (6x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	185 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

Смотрите также: