Документ: Packages_Diodes_Inc, страницы 226-230 | База учебных материалов

Package Outline Dimensions

										GBJ

												GBJ
											Dim	Min	Max
									L		A	29.70	30.30
											A	29.70	30.30
											B	19.70	20.30
									M
		A
K											C	17.00	18.00
											C	17.00	18.00
											D	3.80	4.20
											D	3.80	4.20
											E	7.30	7.70
											E	7.30	7.70

					B						G	9.80	10.20
			_				S		N		H	2.00	2.40
			_				S		N		H	2.00	2.40
J											I	0.90	1.10


								P			J	2.30	2.70

					D
H											K	3.0 X	45°
											K	3.0 X	45°
						C		R			L	4.40	4.80
						C					L	4.40	4.80
I											M	3.40	3.80
											M	3.40	3.80
											N	3.10	3.40


											P	2.50	2.90
											P	2.50	2.90
											R	0.60	0.80

											S	10.80	11.20
	G E			E							S	10.80	11.20
	G E			E							All Dimensions in mm
											All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	226 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

GBPC

H

GBPC

B

Dim

Min

Max

E

A

28.30

28.80

B

7.40

8.00

F

C

16.10

17.10

E

18.80

21.30

A

G

13.80

14.80

C

H

Hole for

#10 screw

5.08

5.59

(AC)

J

17.60

18.60

(+)

F

6.30

6.50

J

A

C

All Dimensions in mm

( - )

(AC)

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	227 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions
			GBPC-W
	H			GBPC-W
				GBPC-W
B			Dim	Min	Max
B			A	28.30	28.80
M			A	28.30	28.80
			B	7.40	8.00
	L		H	Hole for #10 screw
			J	5.08	5.59
	A		J	17.60	18.60
	A	H	K	10.90	11.90
	J	H	L	0.97	1.07
(AC)			M	31.80	-
	( + )		All Dimensions in mm
	( + )
J		K	A
		K
( - )	(AC)
	(AC)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	228 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

										GBU
				A										GBU
													Dim	Min	Max
						K							Dim	Min	Max
				B		K					M		A	21.8	22.3

													B	3.5	4.1
													B	3.5	4.1
								C					C	7.4	7.9
								C					C	7.4	7.9
													D	1.65	2.16
L													D	1.65	2.16
													E	2.25	2.75
		O					D						F	1.95	2.35
	-		~	~	+
													G	1.02	1.27
													G	1.02	1.27
								E					H	4.83	5.33
								E					H	4.83	5.33

							F						J	17.5	18.0
													J	17.5	18.0
													K	3.2 X 45°
J													K	3.2 X 45°
												N	L	18.3	18.8
							G						M	3.30	3.56
							G						M	3.30	3.56
													N	0.46	0.56
									P				O	1.90R
									P				P	0.76	1.0
				H									P	0.76	1.0
				H									All Dimensions in mm
													All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	229 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	E	P
		P
		Ø
	B
	Q
	B
	D
		D1L1
	b13x
	b3x	L
	b3x
	ee
	5°	5
		5
		°
	5	5
	5	°
	°	°
	°

		ITO220AB
°	°	5	A
		5	A1
			A1

0					3
5					3
					5
				°	°
				°
				5
	5°
		°		5°
		5
				A2

°	c
3	c
	ØP
	SECTION B-B

ITO220AB

Dim	Min	Typ	Max
A	4.50	4.70	4.90
A1	3.04	3.24	3.44
A2	2.56	2.76	2.96
b	0.50	0.60	0.75
b1	1.10	1.20	1.35
c	0.50	0.60	0.70
D	15.67	15.87	16.07
D1	8.99	9.19	9.39
e		2.54
E	9.91	10.11	10.31
L	9.45	9.75	10.05
L1	15.80	16.00	16.20
P	2.98	3.18	3.38
Q	3.10	3.30	3.50

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	230 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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