Документ: Packages_Diodes_Inc, страницы 66-70 | База учебных материалов

Package Outline Dimensions

									U-DFN2116-8


	A
							A3
							A3				U-DFN2116-8

			A1
										Dim	Min	Max	Typ
										Dim	Min	Max	Typ
										D	2.05	2.175	2.10
					D					E	1.55	1.675	1.60
					D					E	1.55	1.675	1.60
					D2					D2	1.60	1.80	1.70
					D2					D2	1.60	1.80	1.70
								L		E2	0.30	0.50	0.40
										E2	0.30	0.50	0.40
										A	0.545	0.605	0.575
										A	0.545	0.605	0.575
										A1	0	0.05	0.02
										A3	−	−	0.13
E		E2								A3	−	−	0.13
E		E2								b	0.20	0.30	0.25

										L	0.275	0.375	0.325


										e	−	−	0.50
										All	Dimensions in mm

				e
				e		b

Suggested Pad Layout

U-DFN2116-8

X1

C

G1

Dimensions

Value (in mm)

Y1

G1

0.15

G2

0.20

X1

0.65

X2

0.25

Y1

1.25

Y2

0.50

C

0.40

a

0.10

Y2

G2

X2

a

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	66 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN2523-6

	A
								A3		U-DFN2523-6
								A3		U-DFN2523-6
							A1		Dim	Min	Max	Typ
				D					A	0.57	0.63	0.60
		e							A1	0	0.05	0.02
									A1	0	0.05	0.02
									A3	-	-	0.152
									A3	-	-	0.152

							L (3x)		b	0.25	0.35	0.30


									D	2.45	2.55	2.50
									D	2.45	2.55	2.50
		Pin #1			ID				D1	1.55	1.65	1.60


E		R0.150							e	-	-	0.65
E							E1		E	2.25	2.35	2.30
									E	2.25	2.35	2.30
									E1	1.18	1.28	1.23
				D1
				D1
									L	0.30	0.40	0.35


									L1	0.30	0.40	0.35


			L1 (2x)						All	Dimensions in mm
			L1 (2x)						All	Dimensions in mm
						b (6x)

Suggested Pad Layout

U-DFN2523-6

X1

Y1

Dimensions

Value (in mm)

Y2

C

0.650

Y3

X

0.400

X1

1.700

Y

0.650

Y1

0.450

Y2

1.830

Y

Y3

2.700

C

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	67 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN2626-10

A

A3

A1

Seating Plane

				D
				D2
	C'0.2x45°
	(Pin #1 ID)
				D2/2	E2/2
E	E2
				0
			0
		.1
	0
	R
					L
				e
				b

U-DFN2626-10

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.03
A3	-	-	0.15
b	0.20	0.30	0.25
D	2.55	2.675	2.60
D2	2.05	2.25	2.15
E	2.55	2.675	2.60
E2	1.16	1.36	1.26
e		0.50 BSC
L	0.30	0.40	0.35

All Dimensions in mm

Suggested Pad Layout

X2

X1

Y2

Y1

U-DFN2626-10

Y

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	0.500
	X	0.300
	X1	2.250
	X2	2.300
	Y	0.600
	Y1	1.360
	Y2	3.000

Pin1

C

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	68 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

					U-DFN3016-12


A
							A3		U-DFN3016-12
							A3		U-DFN3016-12
					A1			Dim	Min	Max	Typ
					A1			A	0.545	0.605	0.575
								A	0.545	0.605	0.575
			D					A1	0	0.05	0.02
								A1	0	0.05	0.02
								A3	-	-	0.13
								A3	-	-	0.13
								b	0.20	0.30	0.25
								D	2.95	3.075	3.00
								D2	2.10	2.30	2.20
E						E2		e	-	-	0.50
								e	-	-	0.50
		D2
		D2						E	1.55	1.675	1.60


								E2	0.30	0.50	0.40
								E2	0.30	0.50	0.40
								L	0.28	0.38	0.33
						L (12x)		L	0.28	0.38	0.33
						L (12x)		All Dimensions in mm
								All Dimensions in mm

	e			b (12x)

Suggested Pad Layout

U-DFN3016-12

X1

Y

Dimensions

Value

(12x)

(in mm)

C

0.500

X

0.300

X2

Y1

Y2

X1

2.800

X2

2.250

Y

0.600

Y1

0.450

Y2

2.050

C

X

(12x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	69 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN3020-6

A

A1				D		A3			X2-DFN3020-6
A1				D		A3			X2-DFN3020-6
					e			Dim	Min	Max	Typ
					e
								A	-	0.40	-
								A1	0	0.05	0.02
	Pin #1 ID							A3	-	-	0.15
	Pin #1 ID							b	0.20	0.30	0.25
								b	0.20	0.30	0.25
				D1				D	1.95	2.075	2.00
								D	1.95	2.075	2.00
								D1	0.942	1.142	1.042
E								D1	0.942	1.142	1.042
			E1					e	-	-	0.50

								E	2.95	3.075	3.00
								E1	1.124	1.324	1.224
								E1	1.124	1.324	1.224
								L	0.50	0.60	0.55
								Z	-	-	0.375
							L	Z	-	-	0.375
							L	All	Dimensions in mm


		Z		b

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	70 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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