Документ: Packages_Diodes_Inc, страницы 26-30 | База учебных материалов

Package Outline Dimensions

X1-DFN1212-3

A

A1A3

Seating Plane

D
e
	︶
	b12x
E
	︶
b	L3x

X1-DFN1212-3

Dim	Min	Max	Typ
A	0.47	0.53	0.50
A1	0	0.05	0.02
A3	-	-	0.13
b	0.27	0.37	0.32
b1	0.17	0.27	0.22
D	1.15	1.25	1.20
E	1.15	1.25	1.20
e	-	-	0.80
L	0.25	0.35	0.30

All Dimensions in mm

Suggested Pad Layout

X1-DFN1212-3

X

Y

Dimensions

Value (in mm)

C

0.80

X1

X

0.42

Y2

X1

0.32

(2x)

Y

0.50

Y1

0.50

Y1

Y2

1.50

(2x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	26 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X1-DFN1212-3 (Type B)

		A			A1		A3		X1-DFN1212-3
					A1		A3		Type B
									Type B
								Dim	Min	Max	Typ
								A	0.47	0.53	0.50
								A	0.47	0.53	0.50
			D					A1	0	0.05	0.02
			D					A1	0	0.05	0.02
								A3	-	-	0.13
			e					A3	-	-	0.13
			e					b	0.27	0.37	0.32
								b	0.27	0.37	0.32
								b1	0.17	0.27	0.22
								b1	0.17	0.27	0.22
				b1(2x)				D	1.15	1.25	1.20
				b1(2x)				D2	0.70	0.90	0.80
								D2	0.70	0.90	0.80

E						E2		E	1.15	1.25	1.20



								E2	0.10	0.30	0.20
			D2					E2	0.10	0.30	0.20
			D2					e	-	-	0.80

	L(3x)
	L(3x)							L	0.25	0.35	0.30
								All	Dimensions in mm
								All	Dimensions in mm
			b

Suggested Pad Layout

X1-DFN1212-3 (Type B)

X

Dimensions

Value (in mm)

Y

C

0.80

X

0.42

X2

X1

0.32

Y3

Y2

X2

0.90

X1(2x)

Y

0.50

Y1

0.50

Y1

Y2

0.20

(2x)

Y3

1.50

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	27 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN1212-3 (Type C)

A A1 A3

Seating Plane

	L	D
	L	e
		e
		b1

E		E2
L1	D2	E2
L1
		b

U-DFN1212-3

Type C

Dim	Min	Max	Typ
A	0.47	0.53	0.50
A1	0	0.05	0.02
A3	-	-	0.13
b	0.27	0.37	0.32
b1	0.17	0.27	0.22
D	1.15	1.25	1.20
D2	0.75	0.95	0.85
e	-	-	0.80
E	1.15	1.25	1.20
E2	0.40	0.60	0.50
L	0.25	0.35	0.30
L1	0.65	0.75	0.70

All Dimensions in mm

Suggested Pad Layout

U-DFN1212-3 (Type C)

Y1

X2

X1

Dimensions

Value

(in mm)

C

0.800

G

0.200

Y2

X

0.320

X1

0.520

X2

1.050

G

X

Y

0.450

Y

Y1

0.250

Y2

0.850

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	28 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X1-DFN1216-4

A

A1A3

Seating Plane

		D
		e
Pin#1ID
		C'0.2x45°
E			E2
		D2	L
		D2
	Z		b
	Z

X1-DFN1216-4

Dim	Min	Max	Typ
A	0.47	0.53	0.50
A1	0.00	0.05	0.02
A3	--	--	0.13
b	0.15	0.25	0.20
D	1.15	1.25	1.20
D2	0.75	0.95	0.85
E	1.55	1.65	1.60
E2	0.55	0.75	0.65
e	-	-	0.65
L	0.20	0.30	0.25
Z	-	-	0.175

All Dimensions in mm

Suggested Pad Layout

X1-DFN1216-4

X1

C

X1-DFN1216-4

Dimensions

Value

(in mm)

C

0.65

X

0.25

Y2

Y1

X1

0.90

Y

0.50

Y1

0.70

Y2

2.00

Y

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	29 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

X2-DFN1409-6

		A1	A3
		A1
A			Seating Plane
			Seating Plane
	D
Pin#1ID	e1	Ø6x
Pin#1ID		︶
		︶
		e2
E
	Z14x	Z24x
	︶	Z24x
	︶	︶

X2-DFN1409-6

Dim	Min	Max	Typ
A	-	0.40	0.39
A1	0	0.05	0.02
A3	-	-	0.13
Ø	0.20	0.30	0.25
D	1.35	1.45	1.40
E	0.85	0.95	0.90
e1	-	-	0.50
e2	-	-	0.50
Z1	-	-	0.075
Z2	-	-	0.075

All Dimensions in mm

Suggested Pad Layout

C

Y

C1

Pin1

X

X2-DFN1409-6

		︶	Dimensions	Value
		︶		(in mm)
D6x				(in mm)
D6x			C	1.000
			C	1.000
			C1	0.500
			D	0.300
			G	0.200
	G1		G1	0.200
			G1	0.200
			X	0.400
			X	0.400
			Y	0.150

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	30 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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