Документ: Packages_Diodes_Inc, страницы 71-75 | База учебных материалов

Package Outline Dimensions

V-DFN3020-8

A

A1	A3

Seating Plane

	D
	e

Pin#1ID
E
	L
	Z b

V-DFN3020-8

Dim Min Max Typ

A 0.77 0.83 0.80

A1	0	0.05	0.02
A3	-	-	0.203
b	0.25	0.35	0.30
D	2.95	3.05	3.00
e	-	-	0.65
E	1.95	2.05	2.00
L	0.30	0.40	0.35
Z	-	-	0.375

All Dimensions in mm

Suggested Pad Layout

V-DFN3020-8

X1
X	Y
	Y

Dimensions

Value (in mm)

C

0.650

G

1.000

Y1

G

X

0.400

X1

2.350

Y

0.650

Y1

2.300

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	71 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

	A		W-DFN3020-8 (Type B)
	A
	A1		A3
	A1
			Seating Plane
		D
	D4		D4
	(Pin #1 ID)
E	E2		E2
	D2		D2
			L
	e	e	e
	Z		b

W-DFN3020-8

Type B

Dim Min Max Typ

A	0.77	0.83	0.80
A1	0	0.05	0.02
A3	-	-	0.15
b	0.25	0.35	0.30
D	2.95	3.075	3.00
D2	0.82	1.02	0.92
D4	1.01	1.21	1.11
e	-	-	0.65
E	1.95	2.075	2.00
E2	0.43	0.63	0.53
L	0.25	0.35	0.30
Z	-	-	0.375

All Dimensions in mm

Suggested Pad Layout

W-DFN3020-8 (Type B)

C

X

Dimensions

Value (in mm)

Y1

C

0.650

G1

G

0.285

G

G1

0.090

Y2

Y

X

0.400

X1

1.120

Y

0.730

X1

Y1

0.500

Y2

0.365

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	72 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

W-DFN3020-8 (Type K)

A
													A3				W-DFN3020-8
																	Type K
				A1

														Dim	Min	Max	Typ	Dim	Min	Max	Typ
														Dim	Min	Max	Typ	Dim	Min	Max	Typ
									D					A	0.77	0.83	0.80	E1	0.56	0.76	0.66
									D					A	0.77	0.83	0.80	E1	0.56	0.76	0.66
														A1	0.00	0.05	0.02	E2	0.26	0.46	0.36
					D3					e				A1	0.00	0.05	0.02	E2	0.26	0.46	0.36
					D3					e				A3	-	-	0.15	E3	0.605	0.805	0.705


													L1	b	0.25	0.35	0.30	E4	0.275	0.475	0.375
													L1	b	0.25	0.35	0.30	E4	0.275	0.475	0.375
								L2						D	2.95	3.05	3.00	L	0.425	0.525	0.475
								L2

	E3												E1	D1	1.025	1.225	1.125	L1	0.30	0.40	0.35
														D1	1.025	1.225	1.125	L1	0.30	0.40	0.35
E														D2	1.05	1.25	1.15	L2	0.60	0.70	0.65
			E2
			E2
							D2				D1			D3	0.375	0.575	0.475	Z	-	-	0.375
		E4												D4	0.40	0.60	0.50	e	-	-	0.65
														D4	0.40	0.60	0.50	e	-	-	0.65
													L (4x)	E	1.95	2.05	2.00
		(2x)
		(2x)
								D4 (2x)								All Dimensions in mm


												b
						Z (4x)						b
						Z (4x)

Suggested Pad Layout
				W-DFN3020-8 (Type K)
					Dimensions	Value (in mm)
		X5			C	0.650
		C		X (2x)	X	0.600
		C		X (2x)	X1	0.400
					X1	0.400
				Y (4x)	X2	0.825
				Y (4x)	X3	0.675
					X4	1.250
	X4				X5	2.750
Y8	X4	X3		Y3	Y	0.675
Y8					Y1	0.550
					Y1	0.550
	Y7		Y4	X2	Y2	0.850
	Y7		Y4		Y3	0.755
	Y5	Y2			Y3	0.755
	Y5				Y4	1.455
	Y6
	Y6
					Y5	1.000
		X1 (6x)		Y1	Y6	0.650
		X1 (6x)			Y7	1.455
					Y8	2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	73 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3020-10

A A1	A3
A A1
	Seating Plane

	D
C'0.2X45°		e
C'0.2X45°
Pin#1ID			D13x
			D13x
			︶
EE13x			L10x
︶			L10x
︶		e2	︶
Z4x	e1		b10x
Z4x			b10x
︶			︶

U-DFN3020-10

Dim Min Max Typ

A 0.57 0.63 0.60

A1	0	0.05	0.02
A3	-	-	0.15
b	0.15	0.25	0.20
D	2.95	3.05	3.00
D1	0.25	0.45	0.35
E	1.95	2.05	2.00
E1	0.90	1.10	1.00
e	-	-	0.60
e1	-	-	0.65
e2	0.50	0.70	0.60
L	0.25	0.35	0.30
Z	-	-	0.15

All Dimensions in mm

Suggested Pad Layout

U-DFN3020-10

	X2
		Dimensions	Value
		Dimensions	(in mm)
		C	(in mm)
G1		C	0.650
G1	Y	G	0.150
	Y1	G1	0.600
Y2	Y1	X	0.300
Y2		X1	0.350
G		X1	0.350
	X1	X2	2.800
		Y	0.500
		Y1	1.000
		Y2	2.300

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	74 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

V-DFN3020-10

A	A1	A3

Seating Plane

	D
			e
	Lc	La
R
0
P.1
in5				E2
0				E2
#
1			E2
ID	E2		E2
	E2
		D2a
E	D2	D2a
	D2
	D2c			D2d
E2a	D2c		La	D2d
E2a	E2


	D2b
				E2
L6x	Lb			D2e
L6x
︶	Z4xb10x
︶	︶︵︶

V-DFN3020-10

Dim	Min	Max	Typ
A	0.75	0.85	0.80
A1	0	0.05	0.02
A3	-	-	0.15
b	0.15	0.25	0.20
D	2.95	3.075	3.00
D2	-	-	1.000
D2a	-	-	0.400
D2b	-	-	0.500
D2c	-	-	0.850
D2d	-	-	0.320
D2e	-	-	0.400
E	1.95	2.075	2.00
E2	-	-	0.200
E2a	-	-	0.450
e	-	-	0.60
L	0.25	0.35	0.30
La	-	-	0.460
Lb	-	-	0.550
Lc	-	-	0.548
Z	0.175	0.225	0.20

All Dimensions in mm

Suggested Pad Layout

V-DFN3020-10

︶		︶
Y6x	X10x
		Y1		Y2
		Y1
G				Y5
	G3		Y4	Y5
	G3
Y3
Y3		X1	G1 X2
			G1 X2
Y1
Y1	X3		X5	Y6
	X3		X5	Y6
	X4	Y8	Y9	X6
G2			Y9	X6
G2
	Y7		Y10
			Y10
		C

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	0.600
	G, G2, G3	0.150
	G1	0.240
	X	0.300
	X1	0.950
	X2	0.500
	X3	0.600
	X4	1.100
	X5	0.500
	X6	0.420
	Y	0.500
	Y1	0.650
	Y2	0.560
	Y3	0.550
	Y4, Y5, Y6	0.300
	Y7	0.650
	Y8, Y9	0.300
	Y10	0.560
	Y11	2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	75 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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