Документ: Packages_Diodes_Inc, страницы 76-80 | База учебных материалов

Package Outline Dimensions

V-DFN3020-14

A A1	A3
A A1
	Seating Plane

	D	e
		e
Pin#1ID
	R	D2
E E1	R
E E1	0
	.2
	0
		L
	Z	b

V-DFN3020-14

Dim Min Max Typ

A	0.77	0.83	0.80
A1	0	0.05	0.02
A3	-	-	0.15
b	0.15	0.25	0.20
D	2.95	3.05	3.00
D2	2.40	2.60	2.50
E	1.95	2.05	2.00
E1	0.80	1.00	0.90
e	-	-	0.40
L	0.30	0.40	0.35
Z	-	-	0.20

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	76 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3030-4

													A3

	A																U-DFN3030-4
	A


			A1					Side View

														Dim	Min	Max	Typ	Dim	Min	Max	Typ
									D					Dim	Min	Max	Typ	Dim	Min	Max	Typ
									D					A	0.57	0.63	0.60	E1	0.615	0.815	0.715
									e
														A1	0	0.05	0.02	E2	1.78	1.98	1.88


									H					A3	-	-	0.15	E3	0.715	0.915	0.815
									H					B	0.35	0.45	0.40	H	0.05	0.15	0.10

						D3
		E3				D3			I					D	2.90	3.10	3.00	I	0.20	0.30	0.25
														D	2.90	3.10	3.00	I	0.20	0.30	0.25
														D1	1.075	1.275	1.175	J	0.185	0.285	0.235
E								J				E2		D1	1.075	1.275	1.175	J	0.185	0.285	0.235
														D2	0.925	1.125	1.025	K	0.065	0.165	0.115
				K							D2			D2	0.925	1.125	1.025	K	0.065	0.165	0.115
											D2			D3	1.075	1.275	1.175	L	0.30	0.60	0.45
		E1				D1				M

														E	2.90	3.10	3.00	M	0.05	0.15	0.10


													L	e	-	-	1.30	Z	-	-	0.65
													L			All	Dimensions in		mm

					Z							b
					Z							b
							Bottom View

Suggested Pad Layout

U-DFN3030-4

C

Dimensions

Value (in mm)

C

1.300

G1

0.100

Y3 (2x)

G6

G2

0.150

G3

0.830

G4

0.115

Y2

G1

G3

G5

0.135

G6

0.170

X3

R

Y

G7

0.500

G8

0.500

G5

G2

R

0.150

Y1

X

0.500

X2

X1

1.375

X1

X2

1.225

X3

1.175

G7

G8

Y

1.980

Y1

1.015

X

(4x)

Y2

0.715

Y3

0.650

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	77 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3030-6

A1 A3

ASeating Plane

		D
Pin#1ID		D2

		45°0.35*0.35
E	E2		L

Z4x		e	b

︶

U-DFN3030-6

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.35	0.45	0.40
D	2.95	3.05	3.00
D2	2.25	2.45	2.35
E	2.95	3.05	3.00
E2	1.48	1.68	1.58
e	-	-	0.95
L	0.35	0.45	0.40
Z	-	-	0.35

All Dimensions in mm

Suggested Pad Layout

U-DFN3030-6

X2

X1

C

C-0.409

		Dimensions	Value
			(in mm)
			(in mm)
		C	0.950
		C	0.950
		X	0.500
		X	0.500
		X1	2.400
	Y1Y2
		X2	2.550
		X2	2.550
		Y	0.600
		Y1	1.780


		Y2	3.300
		Y2	3.300
Y

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	78 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

V-DFN3030-6

A1
		A3
		Seating Plane
A	D	e
		e
		L
E	D2	E2
E		E2
		Pin#1ID
	b	Chamfe r0.30X45°
	b
	e1

V-DFN3030-6

Dim	Min	Max	Typ
A	0.80	0.90	0.85
A1	0	0.05	-
A3	-	-	0.203
b	0.30	0.40	0.35
D	2.95	3.05	3.00
D2	1.95	2.05	2.00
E	2.95	3.05	3.00
E2	1.15	1.25	1.20
e	-	-	0.95
e1	-	-	1.90
L	0.45	0.55	0.50

All Dimensions in mm

Suggested Pad Layout

	V-DFN3030-6
	Y		Value
		Dimensions	Value
		C	(in mm)
	X1	C	0.950
Y2 Y1		X	0.450
Y2 Y1		X1	2.100
		Y	0.630
		Y1	1.300
C-0.329		Y2	3.160
C	X
	X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	79 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3030-8

		A1		A3
				A3
A
				Seating Plane
			D
			D2
E		E2
E
		0
	.2			L
0				L
R

Pin#1ID
			e b

U-DFN3030-8

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.29	0.39	0.34
D	2.90	3.10	3.00
D2	2.19	2.39	2.29
e	-	-	0.65
E	2.90	3.10	3.00
E2	1.64	1.84	1.74
L	0.30	0.60	0.45

All Dimensions in mm

Suggested Pad Layout

U-DFN3030-8

Z

Dimensions

Value (in mm)

Z

2.59

X1

G

0.11

X1

2.49

X2

0.65

Y

0.39

C

0.65

X2

G

Y

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	80 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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