Документ: Packages_Diodes_Inc, страницы 81-85 | База учебных материалов

Package Outline Dimensions

U-DFN3030-8 (Type D)

A

A1 A3 Seating Plane

		D
	D/2			D3
		e		D3
E4				E3
		D1	D4	E5
		D1

E		E7
E		E1
		E1		E2
				E2
E/2			D2
E/2				E6
				E6
				L
Z			D5
Z
		b8X
		︶

U-DFN3030-8

Type D

Dim	Min	Max	Typ	Dim	Min	Max	Typ
A	0.570	0.630	0.600	E	2.950	3.075	3.000
A1	0	0.050	0.020	E1	1.800	2.000	1.900
A3	-	-	0.150	E2	0.290	0.490	0.390
b	0.290	0.390	0.340	E3	0.175	0.375	0.275
D	2.950	3.075	3.000	E4	-	-	0.550
D1	2.175	2.375	2.275	E5	-	-	0.815
D2	0.980	1.180	1.080	E6	-	-	0.150
D3	0.105	0.305	0.205	E7	-	-	0.135
D4	-	-	0.925	L	0.300	0.40	0.350
D5	-	-	1.330	Z	-	-	0.355
e	-	-	0.650

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	81 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3030-8 (Type E)


	A									A3		U-DFN3030-8
	A

												Type E

			A1
			A1								Dim	Min	Max	Typ
											Dim	Min	Max	Typ
											A	0.57	0.63	0.60
							D				A1	0	0.05	0.02

						D2
											A3	-	-	0.15


										L (x8)	b	0.20	0.30	0.25


											D	2.95	3.05	3.00
											D	2.95	3.05	3.00
											D2	2.15	2.35	2.25
											D2	2.15	2.35	2.25
											E	2.95	3.05	3.00
E		E2
E		E2									e	-	-	0.65
											e	-	-	0.65
											E2	1.40	1.60	1.50
											E2	1.40	1.60	1.50
											L	0.30	0.60	0.45
											Z	-	-	0.40
											Z	-	-	0.40
											All	Dimensions in mm
				Z	(x4)
				Z	(x4)		e	b	(x8)

Suggested Pad Layout

U-DFN3030-8 (Type E)

X (x8)

C

Y (x8)

	Dimensions	Value (in mm)
	C	0.65
	C	0.65
	C1	2.35
Y1 Y2	X	0.30
	Y	0.65

	Y1	1.60

	Y2	2.75

C1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	82 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

V-DFN3030-8

A3

A1

A

Seating Plane

		D
	D/2
		e
			E2
E		D2	k
E
		D2a	E2a
E/2		D2a
E/2
			L
	Z	b
	Z

V-DFN3030-8

Dim	Min	Max	Typ
A	0.77	0.83	0.80
A1	0	0.05	0.02
A3		0.20BSC
b	0.35	0.45	0.40
D	2.95	3.050	3.00
D2	2.30	2.50	2.40
D2a	2.30	2.50	2.40
E	2.95	3.050	3.00
E2	0.42	0.62	0.52
E2a	0.89	0.109	0.99
e		0.65BSC
k	-	-	0.35
L	0.30	0.40	0.35
z		0.325BSC

All Dimensions in mm

Suggested Pad Layout

V-DFN3030-8

X1

X

C

Dimensions

Value

Y

(in mm)

C

0.650

G

0.195

Y4

G1

0.200

Y5

X

0.450

Y1

X1

2.550

Y

0.450

Y6

Y1

1.044

Y3

Y2

0.566

Y2

Y3

0.389

Y4

0.089

Y5

1.150

Y6

3.200

G

G1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	83 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3030-10

A3

A

SEATING PLANE

A1

Pin#1 ID		D
		D2
E	E2
		L
	z	b
	z	e

U-DFN3030-10

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.20	0.30	0.25
D	2.90	3.10	3.00
D2	2.30	2.50	2.40
e	-	-	0.50
E	2.90	3.10	3.00
E2	1.50	1.70	1.60
L	0.25	0.55	0.40
z	-	-	0.375

All Dimensions in mm

Suggested Pad Layout

U-DFN3030-10

Y

C

X1

G

Dimensions

Value (in mm)

Z

2.60

G

0.15

X

1.80

X1

0.60

G

Y

0.30

C

0.50

Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	84 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3030-12

A

A3

Seating Plane

A1	D
	D
	D2
R
0
.3
Pin#1ID0
︶
E	E2
L
e	b

U-DFN3030-12

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.18	0.28	0.23
D	2.90	3.10	3.00
D2	2.30	2.50	2.40
e	-	-	0.45
E	2.90	3.10	3.00
E2	1.50	1.70	1.60
L	0.25	0.55	0.40

All Dimensions in mm

Suggested Pad Layout
		U-DFN3030-12
C
	G
		Dimensions Value (in mm)
		C	0.45
		G	0.15
Y1		X	0.28
Y1		X1	2.60
		Y	0.60
X1	G	Y1	1.80
X1
	Y
	X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	85 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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