Документ: Packages_Diodes_Inc, страницы 86-90 | База учебных материалов

Package Outline Dimensions

	U-DFN3030-14
A	A1	A3
	A1

	D
	e
(Pin #1 ID)
E	E2
	D2
		L(14x)
Z(4x)	b (14x)

DFN3030-14

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.15	0.25	0.20
D	2.95	3.05	3.00
D2	2.20	2.40	2.30
E	2.95	3.05	3.00
E2	1.60	1.80	1.70
e	-	-	0.40
L	0.30	0.40	0.35
Z	-	-	0.20

All Dimensions in mm

Suggested Pad Layout

		U-DFN3030-14
	X2
	Y (14x)
		Dimensions	Value
		Dimensions	(in mm)
		C	(in mm)
	X1	C	0.400
		X	0.250
	Y2	X1	2.350
	Y1	X2	2.650
		Y	0.600
		Y1	1.750
		Y2	3.400
Pin1
C	X (14x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	86 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-QFN3030-16 (Type B)

A1 A3

A

Side View

					D
					e
	(Pin #1 ID)
				0	0.450
			0
		.2
	0
E	R				E2
E					E2
					D2
					L (16x)
	Z (8x)				b (16x)
					b (16x)

Bottom View

U-QFN3030-16

Type B

Dim	Min	Max	Typ
A	0.55	0.65	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.18	0.28	0.23
D	2.95	3.05	3.00
D2	1.40	1.60	1.50
E	2.95	3.05	3.00
E2	1.40	1.60	1.50
e	-	-	0.50
L	0.35	0.45	0.40
Z	-	-	0.625

All Dimensions in mm

Suggested Pad Layout

C

G1

Y1

X1

X (16x)

U-QFN3030-16 (Type B)

G

	Dimensions	Value
	Dimensions	(in mm)
		(in mm)
	C	0.500
	G	0.150
	G1	0.150
	X	0.350
	X1	1.800
	Y	0.600
	Y1	1.800

Y (16x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	87 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN3216-14

A1 A3 A

Seating Plane

		D
Pin#1ID		D2

C0.2x45°
E			E/2
E
E2
			L
	b	e	Z

U-DFN3216-14

Dim	Min	Max	Typ
A	0.545	0.605	0.575
A1	0	0.05	0.02
A3	-	-	0.127
b	0.15	0.25	0.20
D	3.15	3.275	3.20
D2	2.70	2.90	2.80
E	1.55	1.675	1.60
E2	0.45	0.65	0.55
e	-	-	0.40
L	0.275	0.375	0.325
Z	0.25	0.35	0.30

All Dimensions in mm

Suggested Pad Layout

U-DFN3216-14

X2

C

Y

Dimensions

Value

(in mm)

C

0.400

X

0.250

Y1Y2

X1

2.850

X2

2.650

Y

0.525

Y1

0.550

Pin1

X

Y2

1.900

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	88 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

DFN322

		D		e		e	b (3x)
		D					b (3x)
												DFN322


									L (3x)		Dim	Min	Max	Typ
											A	0.800	1.00	0.850
											A	0.800	1.00	0.850
											A	-	0.050	-
			E								A3	0.153	0.253	0.203
											A3	0.153	0.253	0.203
										E2	b	0.180	0.300	0.230
											b	0.180	0.300	0.230
								E4			D	1.900	2.100	2.000
											D	1.900	2.100	2.000
											D2	1.220	1.420	1.320
											D2	1.220	1.420	1.320

											e	-	-	0.650
											e	-	-	0.650
											E	1.900	2.100	2.000

											E2	0.780	0.990	0.880
											E2	0.780	0.990	0.880
					D2						E4	0.480	0.680	0.580


			A1								L	0.300	0.500	0.400
	A3		A1								L	0.300	0.500	0.400

A											All Dimensions in mm

Suggested Pad Layout

DFN322

C

X (3x)

Dimensions

Value

(in mm)

Y (2x)

C

0.65

G

0.20

X

0.35

Y4

Y1

X1

1.52

Y3

Y

0.55

Y1

0.98

Y2

0.47

Y2

Y3

0.63

Y4

2.20

X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	89 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

		X1-DFN3313-8
	A
	A1	A3
		Seating Plane
	1	D
	1	︶
		︶
		L6x

E e

	8
︶
La2x		e1
		b

Suggested Pad Layout

		X1-DFN3313-8
	A
	A1	A3
		Seating Plane
	1	D
	1	︶
		︶
		L6x
	E	e
	E
	︶	8
	La2x	e1
		b

X1-DFN3313-8

Dim	Min	Max	Typ
A	0.37	0.48	0.42
A1	0	0.05	0.02
A3	-	-	0.13
b	0.20	0.30	0.25
D	3.25	3.38	3.30
E	1.25	1.38	1.30
e		0.50 BSC
e1		1.25 BSC
L	0.30	0.43	0.38
La	0.57	0.70	0.65

All Dimensions in mm

X1-DFN3313-8

Dim	Min	Max	Typ
A	0.37	0.48	0.42
A1	0	0.05	0.02
A3	-	-	0.13
b	0.20	0.30	0.25
D	3.25	3.38	3.30
E	1.25	1.38	1.30
e		0.50 BSC
e1		1.25 BSC
L	0.30	0.43	0.38
La	0.57	0.70	0.65

All Dimensions in mm

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	90 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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