Документ: Packages_Diodes_Inc, страницы 96-100 | База учебных материалов

Package Outline Dimensions

			V-DFN4030-14
	D	L
	D
		D2
E			E2
PIN1DOT		e	b
BYMARKIN G
A1	A3		PIN#1ID
A1		A	CHAMF ER0.30X45°
		A

V-DFN4030-14

Dim	Min	Max	Typ
A	0.80	0.90	0.85
A1	0	0.05	0.02
A3	-	-	0.203
b	0.20	0.30	0.25
D	3.95	4.05	4.00
D2	3.15	3.25	3.20
E	2.95	3.05	3.00
E2	1.65	1.75	1.70
e	-	-	0.50
L	0.35	0.45	0.40

All Dimensions in mm

Suggested Pad Layout

V-DFN4030-14

G

X1

Y

Dimensions

Value

(in mm)

C

0.50

G

0.20

Y1Y2

X

0.30

G

X1

3.30

Y

0.55

Y1

1.80

Y2

3.30

C

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	96 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

			W-DFN4030-14
	D	L
	D
		D2
E			E2
PIN1DOT		e	b
BYMARKIN G
A1	A3		PIN#1ID
A1		A	CHAMF ER0.30X45°
		A

W-DFN4030-14

Dim	Min	Max	Typ
A	0.70	0.80	0.75
A1	0	0.05	0.02
A3	-	-	0.203
b	0.20	0.30	0.25
D	3.95	4.05	4.00
D2	3.15	3.25	3.20
E	2.95	3.05	3.00
E2	1.65	1.75	1.70
e	-	-	0.50
L	0.35	0.45	0.40

All Dimensions in mm

Suggested Pad Layout

W-DFN4030-14

G

X1

Y

Dimensions

Value

(in mm)

C

0.50

G

0.20

Y1Y2

X

0.30

G

X1

3.30

Y

0.55

Y1

1.80

Y2

3.30

C

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	97 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

U-DFN4040-8

	A1A3
A	Seating Plane
	Seating Plane

	D
Pin#1ID	e
︶
E
E2
	D2
Z	b

U-DFN4040-8

Dim	Min	Max	Typ
A	0.57	0.63	0.60
A1	0	0.05	0.02
A3	-	-	0.15
b	0.20	0.30	0.25
D	3.95	4.05	4.00
D1	2.05	2.25	2.15
D2	0.90	1.10	1.00
E	3.95	4.05	4.00
E1	1.00	1.20	1.10
E2	2.50	2.70	2.60
e	-	-	0.80
L	0.35	0.45	0.40
Z	-	-	0.675

All Dimensions in mm

Suggested Pad Layout

		U-DFN4040-8
X	C
1
C-0.279	X1	Y	Dimensions	Value
C-0.279			Dimensions	(in mm)
			C	0.800
X2	Y2		X	0.350
	X3		X1	1.150
			X2	1.100
		Y3Y4	X3	2.250
Y1			X4	2.750
	Y2		X5	3.650
	X3		Y	0.600
			Y1	2.700
			Y2	1.200
	X1		Y3	2.700
	X1		Y4	4.300
			Y4	4.300
	X4
	X5

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	98 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

W-DFN5020-6

A							A3
									W-DFN5020-6
	A1


				D				Dim	Min	Max	Typ
			e					A	0.75	0.85	0.80
								A1	0	0.05	0.02
								A1	0	0.05	0.02
			D2					A3	-	-	0.15
								b	0.20	0.30	0.25
			Pin		1 ID			D	1.90	2.10	2.00
			Pin		1 ID			D	1.90	2.10	2.00
								D2	1.40	1.60	1.50
								D2	1.40	1.60	1.50
E							E2	e	-	-	0.50
								E	4.90	5.10	5.00
								E2	2.80	3.00	2.90
								L	0.35	0.65	0.50
								Z	-	-	0.375
								Z	-	-	0.375
								All	Dimensions in mm
							L	All	Dimensions in mm



		Z				b

Suggested Pad Layout

W-DFN5020-6

Y

X

C

G

Dimensions

Value (in

mm)

X1

Y2

C

0.50

G

0.35

Y3

X

0.35

X2

X1

0.90

X2

1.80

Y

0.70

Y2

1.60

Y3

3.20

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	99 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

A

Pin#1ID

E

	V-DFN5060-4
	A1
	A3
	Seating Plane
D
e	L1
1
	L
4	b
	b

W-DFN5060-4

Dim	Min	Max	Typ
A	0.75	0.85	0.80
A1	0	0.05	0.02
A3	-	-	0.203
b	0.65	0.75	0.70
D	4.95	5.05	5.00
e	-	-	4.00
E	5.95	6.05	6.00
L	0.65	0.75	0.70
L1	0.05	0.15	0.10

All Dimensions in mm

Suggested Pad Layout

Z

V-DFN5060-4

C

Dimensions

Value

(in mm)

Y1

C

4.00

X

0.75

Y

0.95

X (4x)

Y1

6.20

Z

4.75

Y (4x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	100 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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