Документ: Packages_Diodes_Inc, страницы 151-155 | База учебных материалов

Package Outline Dimensions

	D
	b1
e1	b
	e

A	A1	7
		7
		°
		°
		7

SOT223

Q

C

	E	E1
Gauge
Plane
	0.25
Seating	L
Plane	L
Plane

		°
		0
-1
°
0

SOT223

Dim	Min	Max	Typ
A	1.55	1.65	1.60
A1	0.010	0.15	0.05
b	2.90	3.10	3.00
b1	0.60	0.80	0.70
C	0.20	0.30	0.25
D	6.45	6.55	6.50
E	3.45	3.55	3.50
E1	6.90	7.10	7.00
e	-	-	4.60
e1	-	-	2.30
L	0.85	1.05	0.95
Q	0.84	0.94	0.89

All Dimensions in mm

Suggested Pad Layout

SOT223

X1

Dimensions

Value (in mm)

Y1

X1

3.3

X2

1.2

Y1

1.6

Y2

1.6

C1

6.4

C2

2.3

Y2

C2

X2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	151 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT25

	A								SOT25
	A								SOT25
								Dim	Min	Max	Typ
								Dim	Min	Max	Typ
								A	0.35	0.50	0.38
			B		C			A	0.35	0.50	0.38
			B		C			B	1.50	1.70	1.60
								B	1.50	1.70	1.60
								C	2.70	3.00	2.80
								C	2.70	3.00	2.80
								D	-	-	0.95
	H							H	2.90	3.10	3.00
	H							J	0.013	0.10	0.05

								K	1.00	1.30	1.10


K							M	L	0.35	0.55	0.40
K				N

								M	0.10	0.20	0.15
								M	0.10	0.20	0.15
J								N	0.70	0.80	0.75
								N	0.70	0.80	0.75
		D				L		α	0°	8°	-


								All	Dimensions in mm

Suggested Pad Layout

SOT25


C2					C2
C2

Dimensions

SOT25

Z

3.20

G

1.60

G

C1

X

0.55

Z

Y

0.80

C1

2.40

Y

C2

0.95

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	152 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT353

	A
	A
									SOT353
								Dim	Min		Max	Typ
								Dim	Min		Max	Typ
								A	0.10		0.30	0.25
			B		C			A	0.10		0.30	0.25
			B		C			B	1.15		1.35	1.30
								B	1.15		1.35	1.30
								C	2.00		2.20	2.10
								C	2.00		2.20	2.10

								D		0.65 Typ
								D		0.65 Typ
	H							F	0.40		0.45	0.425
								H	1.80		2.20	2.15

								J	0		0.10	0.05
K							M
K				N
								K	0.90		1.00	1.00


								L	0.25		0.40	0.30
J								L	0.25		0.40	0.30
J		D				L		M	0.10		0.22	0.11
		D				L		M	0.10		0.22	0.11
									0°		8°	-


								All	Dimensions in mm
								All	Dimensions in mm

Suggested Pad Layout

SOT353

C2

Dimensions

SOT353

Z

2.5

G

1.3

G

C1

Z

X

0.42

Y

0.6

C1

1.9

Y

C2

0.65

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	153 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SC74R / SOT26

	A
	A
								SC74R / SOT26
								SC74R / SOT26
								Dim	Min	Max	Typ
								A	0.35	0.50	0.38
				B	C			A	0.35	0.50	0.38
				B	C			B	1.50	1.70	1.60
								B	1.50	1.70	1.60
								C	2.70	3.00	2.80
								C	2.70	3.00	2.80
								D	-	-	0.95
								D	-	-	0.95

	H							F	-	-	-
	H							H	2.90	3.10	3.00
								J	0.013	0.10	0.05
K								J	0.013	0.10	0.05
K							M	K	1.00	1.30	1.10
							M	K	1.00	1.30	1.10
								L	0.35	0.55	0.40
								L	0.35	0.55	0.40
J						L		M	0.10	0.20	0.15
J		D	F					M	0.10	0.20	0.15
								α	0°	8°	-


								All	Dimensions in mm
								All	Dimensions in mm

Suggested Pad Layout

SC74R / SOT26

C2

Dimensions

SC74R / SOT26

Z

3.20

G

1.60

G

C1

Z

X

0.55

Y

0.80

C1

2.40

Y

C2

0.95

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	154 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Package Outline Dimensions

SOT363

	A
	A
								SOT363
							Dim	Min	Max	Typ


							A	0.10	0.30	0.25
			B	C			A	0.10	0.30	0.25
			B	C			B	1.15	1.35	1.30
							B	1.15	1.35	1.30
							C	2.00	2.20	2.10
							C	2.00	2.20	2.10
							D		0.65 Typ
							D		0.65 Typ

	H						F	0.40	0.45	0.425
	H						H	1.80	2.20	2.15
							J	0	0.10	0.05
K						M	J	0	0.10	0.05
K							K	0.90	1.00	1.00
							K	0.90	1.00	1.00
							L	0.25	0.40	0.30
							L	0.25	0.40	0.30
J							M	0.10	0.22	0.11
J		D F			L		M	0.10	0.22	0.11
		D F			L		α	0°	8°	-
							α	0°	8°	-
							All	Dimensions in mm
							All	Dimensions in mm

Suggested Pad Layout

SOT363

C2
					C2

Dimensions

SOT363

Z

2.5

G

1.3

G

C1

X

0.42

Z

Y

0.6

C1

1.9

Y

C2

0.65

X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Rev. 76	155 of 263	Package Outline Dimensions
	www.diodes.com	Suggested Pad Layout
		© Diodes Incorporated

Материал: Packages_Diodes_Inc

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